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ocr_text: Heterogeneous Material Integration on Si Platforms\n» Growing need to integrate more functionality into a smaller form factor with power-\nperformance benefits\n» Need for disruptive solutions to solve Si CMOS scaling limitations\n===) new on-chip functionalities (sensors, optoelectronics, power management, RF...)\n» Complex electronic system are still fabricated using a wide range (mix) of technologies\n(combining chips of last generation CMOS with older process technology chips in RF, MEMS...)\n» Integration of heterogeneous components for performance, power & cost improvement\nBond multichip modules & system in package —\nHigh Mobility\n3 3 neues ==> Co-integration at the material level Ce\n; ] | som (in a compact volume)\nIn SiGe
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