id: 985e6a18771d4d119c6e5b0a76e72bd6
parent_id: 
item_type: 1
item_id: 0f242382aa9143ac9c86621925ae1df8
item_updated_time: 1764345468542
title_diff: "[{\"diffs\":[[1,\"干货分享丨Wafer晶圆半导体工艺介绍（2023精华版）\"]],\"start1\":0,\"start2\":0,\"length1\":0,\"length2\":28}]"
body_diff: "[{\"diffs\":[[1,\"<html>\\\r\\\n<head>\\\r\\\n  <title>干货分享丨Wafer晶圆半导体工艺介绍（2023精华版）</title>\\\r\\\n  <basefont face=\\\"微软雅黑\\\" size=\\\"2\\\" />\\\r\\\n  <meta http-equiv=\\\"Content-Type\\\" content=\\\"text/html;charset=utf-8\\\" />\\\r\\\n  <meta name=\\\"exporter-version\\\" content=\\\"YXBJ Windows/608924 (zh-CN, DDL); Windows/10.0.0 (Win64); EDAMVersion=V2;\\\"/>\\\r\\\n  <meta name=\\\"application-data:yinxiang.noteLayout\\\" content=\\\"{}\\\"/>\\\r\\\n  <style>\\\r\\\n\\tbody, td {\\\r\\\n\\t  font-family: 微软雅黑;\\\r\\\n\\t  font-size: 12pt;\\\r\\\n\\t}\\\r\\\n  </style>\\\r\\\n</head>\\\r\\\n<body>\\\r\\\n<a name=\\\"2631\\\"></a>\\\r\\\n<h1>干货分享丨Wafer晶圆半导体工艺介绍（2023精华版）</h1>\\\r\\\n\\\r\\\n<div><span><h1 style=\\\"other-props:eyJibG9ja0lkIjoiRmJobFRTSEt5MUsifQ==;\\\"> 干货分享丨Wafer晶圆半导体工艺介绍（2023精华版） </h1><div> 电子制造工艺技术 </div><div><b>目录大纲：</b></div><ul><li><div><br/></div><div>目的：分享工艺流程介绍</div></li><li><div><br/></div><div>概述：</div></li></ul><ol><li><div><br/></div><div>芯片封装的目的</div></li><li><div><br/></div><div>工艺流程</div></li></ol><div><b>芯片封装的目的（The purpose of chip packaging）:</b></div><div>芯片上的IC管芯被切割以进行管芯间连接，通过引线键合连接外部引脚，然后进行成型，以保护电子封装器件免受环境污染（水分、温度、污染物等）；保护芯片免受机械冲击；提供结构支撑；提供电绝缘支撑保护。它可以更轻松地连接到PCB板上。</div><img src=\\\":/29f401f493944eabb8871b0065057f08\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><img src=\\\":/14c48a199aaf4d9aaa431decad822aef\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"583px\\\"/><div><b>工艺流程（Process flow）:</b></div><img src=\\\":/9a668e9165f946e196d21745d9b74f47\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><div><b>晶圆研磨（Wafer Grinding）:</b></div><p>目的Purpose:</p><p>Make the wafer to suitable thickness for the package</p><p>将芯片制作成适合封装的厚度</p><img src=\\\":/0219daa2936247e7af93bebe9472d6b4\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><table style=\\\"--en-fitwindow:false;border-left:1px solid #d9d9d9;border-top:1px solid #d9d9d9;border-collapse:collapse;width:380px;\\\" width=\\\"380px\\\"><colgroup><col style=\\\"width: 190px;\\\"></col><col style=\\\"width: 190px;\\\"></col></colgroup><tbody><tr><td style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>Machine</p></td><td style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>Disco(DFG8540)</p></td></tr><tr><td style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>Material</p></td><td style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>UV Tape</p></td></tr><tr><td rowspan=\\\"2\\\" style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>Control</p></td><td style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>DI Wafer Resistivity</p></td></tr><tr><td style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>Vacuum Pressure</p></td></tr><tr><td rowspan=\\\"4\\\" style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>Check</p></td><td style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>Wafer Roughness</p></td></tr><tr><td style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>Wafer Warpage</p></td></tr><tr><td style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>Wafer Thickness</p></td></tr><tr><td style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>Visual Inspection</p></td></tr></tbody></table><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><img src=\\\":/2adda62b23ff428187c0cb0299e1d8fe\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><p><b>放入晶圆 Wafer Mount:</b></p><p>目的Purpose:</p><p>Combine the wafer with Dicing tape onto the frame for die sawing</p><p>将晶圆片与切割带装在框架上进行模切</p><img src=\\\":/70669960c3504d24ab14c3c5899ba79e\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><p><b>锯晶圆 Wafer Saw:</b></p><p>目的Purpose:</p><p>Make the wafer to unit can pick up by die bonder</p><div>使晶圆片单元能被粘片机拾取（吸取）</div><img src=\\\":/a39f10a251e54713919bf8dd01799fac\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><table style=\\\"--en-fitwindow:false;border-left:1px solid #d9d9d9;border-top:1px solid #d9d9d9;border-collapse:collapse;width:380px;\\\" width=\\\"380px\\\"><colgroup><col style=\\\"width: 190px;\\\"></col><col style=\\\"width: 190px;\\\"></col></colgroup><tbody><tr><td style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>Machine</p></td><td style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>Disco(DFD4360/DAD3350)</p></td></tr><tr><td style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>Material</p></td><td style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>Saw Blade</p></td></tr><tr><td rowspan=\\\"2\\\" style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>Control</p></td><td style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>DI Water Resistivity(+CO2)</p></td></tr><tr><td style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>Sawing/Cleaning Parameter</p></td></tr><tr><td rowspan=\\\"2\\\" style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>Check</p></td><td style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>Kerf Chipping Width</p></td></tr><tr><td style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>Visual Inspection</p></td></tr></tbody></table><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div style=\\\"padding-left:200px;\\\"><br/></div><div style=\\\"padding-left:200px;\\\"><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><img src=\\\":/02dd7471a18a4c85a3d58a8d4e12e3cd\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><img src=\\\":/767879b562ed48a39c423b4f05163942\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><img src=\\\":/fc4671ec214243489430d05c3260a741\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><img src=\\\":/1048f1560b7a4328b13dca6d90bc60b9\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><p><b>BD和SD的流程区别 Process difference between BD and SD: </b></p><img src=\\\":/271387861aee420fa1d69210d0303137\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><p><b>SDBG:</b></p><img src=\\\":/bb217998fe7e4c509c5ca2b2fdbf0417\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><p><b>质量控制 Quality Control</b></p><img src=\\\":/f272ddeb12354910971363a42d177b9e\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><img src=\\\":/8129e075abe6403a80b8ffaf28e5a4f7\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><p><b>上芯Die Attach:</b></p><p>目的Purpose:</p><p>Pick up the die and attach it on the lead frame by epoxy</p><p>吸取芯片，用环氧树脂将其附在引线框上</p><img src=\\\":/bf487cbd02e14151b05cfdbdfdecc489\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><img src=\\\":/4a3abf0f47424f47b9d7319b3a9aa1e8\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"671px\\\"/><table style=\\\"--en-fitwindow:false;border-left:1px solid #d9d9d9;border-top:1px solid #d9d9d9;border-collapse:collapse;width:380px;\\\" width=\\\"380px\\\"><colgroup><col style=\\\"width: 190px;\\\"></col><col style=\\\"width: 190px;\\\"></col></colgroup><tbody><tr><td style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>Machine</p></td><td style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>ESEC/ASM</p></td></tr><tr><td style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>Material</p></td><td style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>Epoxy/Leadframe</p></td></tr><tr><td rowspan=\\\"2\\\" style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>Control</p></td><td style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>Bonding Parameter</p></td></tr><tr><td style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>Collect/Needle Height</p></td></tr><tr><td rowspan=\\\"3\\\" style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>Check</p></td><td style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>Epoxy Thickness/Die Tilt</p></td></tr><tr><td style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>Bonding Position/Die Shear</p></td></tr><tr><td style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>Visual Inspection</p></td></tr></tbody></table><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div style=\\\"padding-left:200px;\\\"><br/></div><div style=\\\"padding-left:200px;\\\"><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><img src=\\\":/a7123803f5f9457b9241ab07446669b4\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><img src=\\\":/453e92b5a44046b3b166d0611e2bed81\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"602px\\\"/><p><b>芯片连接方法 Die attach  method：</b></p><p>Eutectic, Epoxy, soft solder, DAF</p><p>共晶，环氧，软钎料，DAF</p><img src=\\\":/0d143df2c2864f6784fb5481c2e195a8\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><img src=\\\":/4f2d8c6f66834257a95d590b2010cdff\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><img src=\\\":/a7910fc035484aee9f88437ef5acaeca\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><p><b>粘着剂的工艺流程：</b></p><img src=\\\":/c6c7859cb0504496959394df4b7c8b20\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><img src=\\\":/e90eeab67c194c3ca7df8706915952cf\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><p><b>质量控制Quality Control：</b></p><img src=\\\":/2f714bf691614d32bc9b75c4d07d1997\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"397px\\\"/><img src=\\\":/f3a96b0e11314c48814c4d4b22229d72\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><img src=\\\":/3b4d07f5f6954f85835bb56e7c9d1360\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"448px\\\"/><img src=\\\":/c0c3c994b000429ea4960fadf7aedb1f\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><img src=\\\":/c647f4c80f7a47bcb6a052d2dcbb0ac0\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"545px\\\"/><p>空洞不良：焊料装片单个空洞面积大于3%芯片面积，累计空洞面积大于8%芯片面积Solder paste 装片单个空洞面积大于5%芯片面积，累计空洞面积大于10%芯片面积</p><p><b>环氧固化 Epoxy cure：</b></p><p>目的Purpose: </p><p>Solidify the epoxy after D/A   固化环氧树脂后D/A</p><img src=\\\":/baa93b35b6f5424f8ea426d6bebd215e\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"666px\\\"/><p>固化烤炉箱Oven</p><img src=\\\":/1a1b85efc6ab45058d54e08bdd0d1ecb\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><p>烤箱内Inside</p><img src=\\\":/579eaa8715de46249046f79c3272b3af\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><p><b>引线键合Wire Bonding：</b></p><p>目的 Purpose:</p><p>Use ultrasonic, force , temp, time to connect the bond pad with lead frame by gold/copper/Silver/Aluminium wire.</p><p>采用超声波、力、温度、时间等方法，将焊盘与引线框通过金/铜/银/铝导线连接。</p><img src=\\\":/bdacf629c73b4005b7fc798aed2e8e20\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"501px\\\"/><img src=\\\":/f4ba3570346546139477ff065bd32ceb\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"647px\\\"/><p>球键合 Ball Bonding</p><p><b>焊线焊头动作步骤分解：</b></p><p>1•  焊头在打火高度( 复位位置 )  </p><img src=\\\":/03c28420966848f3bd1e9aca93b00493\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><p>2• 焊头由打火高度下降到第一焊点搜索高度</p><img src=\\\":/8e60662b629c4fd5b76f8452d2369f3b\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><p>3• 第一焊点接触阶段</p><img src=\\\":/a7720b1abcd045ce8c520ad3fc03ba66\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><p> </p><p>4• 第一焊点焊接阶段</p><img src=\\\":/12ca778a8f944b68b704a8b91404410c\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><p>5• 完成第一点压焊后, 焊头上升到反向高度</p><img src=\\\":/1debcef92c5f45f3ace2475a0ef0df33\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><p>6• 反向距离</p><img src=\\\":/da8235d13d8e4ce48c8a6d2a62fe186e\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><p>7• 焊头上升到线弧高度位置</p><img src=\\\":/cac4f1cae4e44d86a1b0e2714c946d5a\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><p>8• 搜索延迟</p><img src=\\\":/43315357b8784941bcbe9efd03f4bf5e\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><p>9• XYZ 移向第二压点搜索高度</p><img src=\\\":/f47c5569c4ff497f9f32e0c6eb6070c7\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><p>10• 第二焊点接触阶段 </p><img src=\\\":/f76c46554df34ea0910760435639c329\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><p>11• 第二压点焊接阶段</p><img src=\\\":/8d8d005aa00e44dea470e602ab53e07f\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><p>12• 焊头在尾丝高度</p><img src=\\\":/701bf4086f3c4741b19119d4b9f18e7f\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><p>13• 拉断尾丝</p><img src=\\\":/4f2611e70859417282c44d7f092caa15\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><p>14•金球形成，开始下一个压焊过程</p><img src=\\\":/1833b53d97714006b96b138ab5961ef1\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><img src=\\\":/22fd8aa4dd1749f08a081775fd883e82\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><img src=\\\":/9e56800903104bfd8c5580be8d4adeeb\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"497px\\\"/><p>楔键合 Wedge Bonding</p><p>The difference between Ball Bonding and Wedge Bonding</p><p>球焊Ball Bonding和键合Wedge Bonding的区别</p><p>1、在一定温度下，在超声发生器作用下，通过焊能头使电能转变为机械振动，带动金球、铜球与铝层产生塑型形变，形成良好的牢度。(在形成球时需要用氢氮混合气体避免铜线氧化）</p><p>2、键合又叫锲形焊，是因为它的压点象锲形(三棱镜)。在常温下，铝丝通过换能头及劈刀的机械振动，与铝层粘合在一起。它的优点是不会产生化合物。</p><img src=\\\":/52f7314992dd489ca8f71e3457f5a044\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"610px\\\"/><img src=\\\":/ce6a4f0e09d544f7a4c62f23b266da2b\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"596px\\\"/><p>质量控制 Quality Control：</p><img src=\\\":/1d3248c6621f45acaa1d22bce98ac507\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"603px\\\"/><img src=\\\":/46fee201b5b6479396a3474641ea8e40\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"604px\\\"/><img src=\\\":/7f795bcd98ab40beab87c6fddd8b0717\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><p><b>Wire Offset  0</b></p><img src=\\\":/9ccec36694f7464a854bdcadbf8d08fd\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><p>Wire Offset 45</p><img src=\\\":/980a73d9cc064d419ab7b975e8463492\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><p>Wire Offset 55</p><img src=\\\":/a662aa4c9d864a33833698f755fd65ab\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><p>Wire Offset 65</p><img src=\\\":/ee228bcf0e5f4e1dbd4cfb3e01436f8f\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"680px\\\"/><p>BSOB BALL</p><img src=\\\":/ba3c264310594c84b708340e7af41e6a\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"680px\\\"/><img src=\\\":/1f49e1b56bd24d528f8e82eef53bd19a\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"680px\\\"/><img src=\\\":/55f0ab4f0a3143cbbb6061b4d943a414\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"680px\\\"/><p>最佳BSOB效果</p><img src=\\\":/679ac0cc3d7a42dcb85332790ccffde6\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"680px\\\"/><p>FAB过大，BASE参数过小</p><img src=\\\":/5e914d2d80e54c7597f82e567aeb0dee\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"680px\\\"/><p>BASE参数过大</p><img src=\\\":/c36ba7bd402343d889e2881770fd07ca\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"680px\\\"/><p>正常</p><img src=\\\":/284565ad0b5e4aabb05a225cb1a49fc1\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"680px\\\"/><p>BALL过大，STICH BASE参数过小</p><img src=\\\":/9b7b0c2d550847b3b81e37314f5ec6a5\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"680px\\\"/><p>BALL过小，STICH BASE参数过大</p><img src=\\\":/fa95f3e92405498ebc98ba78e927b1ca\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"680px\\\"/><p>正常</p><img src=\\\":/3af21a14d70f41f088f37f114d5f507b\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"680px\\\"/><img src=\\\":/a24ea169f7c04309ae3de4e57d7b7d44\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"680px\\\"/><img src=\\\":/09fd915ec4eb4bba852db0bdc3c6a315\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"680px\\\"/><img src=\\\":/279f881ca83c46a5a0fd7f6c89547c55\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"680px\\\"/><p>BSOB 2nd stich不良</p><img src=\\\":/0e16f1b7216a49599f63208e9c1fd77e\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><img src=\\\":/352f5faabed140e795926ccd39022cb2\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"680px\\\"/><p>好</p><img src=\\\":/e76797afea1347429220326a085a5e59\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"680px\\\"/><p><b>不好</b></p><img src=\\\":/c8f0fafae4a84bfb98810604fe3accc6\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"680px\\\"/><p>好</p><img src=\\\":/df4be02a68254c0ca30dcfcef2d357c5\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"680px\\\"/><p><b>不好</b></p><img src=\\\":/363eecc3fb3048feb483c82b19993347\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"513px\\\"/><p>球形不良：球径大小不良，＜2倍焊丝直径或＞4倍 焊丝直径；特殊情况（压区尺寸小于常规 情况）下，球径＜焊区单边边长的70%或＞焊区单边边长为不良；</p><p>球厚度不良:压扁变形,球厚度&lt;30%焊线直径或球厚度&gt;70%焊线直径为不良</p><img src=\\\":/8353f45f585a4993b6385296a1e78474\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"628px\\\"/><p>二焊点不良：第二焊点根部有撕裂或隐裂现象</p><img src=\\\":/28c5a26670494eda86208954afebc353\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"354px\\\"/><p><b>弧度不良</b>：焊丝与芯片，引线框及其他焊丝的最短距离＜2倍焊丝直径</p><img src=\\\":/febac01848b143ceb12428d72c7a64ce\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"417px\\\"/><p>IMC Check</p><p><b>成型 Molding：</b></p><p>目的 Purpose:</p><p>Seal the product with EMC to prevent die, gold wire from being damaged, contaminated and oxygenic.</p><p>用电磁兼容性（EMC）对产品进行密封，以防止模具、金线被损坏、污染和氧化。</p><img src=\\\":/b59486a895f44773bd4bfb99b5c24c95\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><img src=\\\":/0271ad82c01d423bab99940b169f53fc\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><p>EMC为黑色块状，低温存储，使用前需先回温。其特性在高温下先处于熔融状态，然后会逐渐硬化，最终成型</p><img src=\\\":/aff135e3042d42b69aa6fe7dd1cc6b55\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"641px\\\"/><table style=\\\"--en-fitwindow:false;border-left:1px solid #d9d9d9;border-top:1px solid #d9d9d9;border-collapse:collapse;width:380px;\\\" width=\\\"380px\\\"><colgroup><col style=\\\"width: 190px;\\\"></col><col style=\\\"width: 190px;\\\"></col></colgroup><tbody><tr><td style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>Machine</p></td><td style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>TOWA/ASM</p></td></tr><tr><td style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>Material</p></td><td style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>Compound</p></td></tr><tr><td rowspan=\\\"2\\\" style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>Control</p></td><td style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>Mold Temp; Clamp pressure</p></td></tr><tr><td style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>Transfer pressure/time; Cure time</p></td></tr><tr><td rowspan=\\\"3\\\" style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>Check</p></td><td style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>Body Thickness/Wire Curvature</p></td></tr><tr><td style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>Void/Delamination</p></td></tr><tr><td style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>Visual Inspection</p></td></tr></tbody></table><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div style=\\\"padding-left:200px;\\\"><br/></div><div style=\\\"padding-left:200px;\\\"><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><img src=\\\":/8bd187810cfe4c37b7711db43485450c\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"575px\\\"/><p>After Mold</p><img src=\\\":/0122a5fee3444a9d9cad82ff4f74e0a6\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><img src=\\\":/908255783bf44e0d93cc81f4ece469af\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><img src=\\\":/02b441b0fe0a488eab0f4d0bdfd5ec8f\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><img src=\\\":/c09796a40a7a4b1d8583fae0c549eb63\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><img src=\\\":/2a80fa183a634f9a9e880e3c16a24dcb\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><p>质量控制Quality Control：</p><img src=\\\":/ff9d20fcb2a240668c1dbef2a3e0fbcc\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"633px\\\"/><p>孔洞</p><img src=\\\":/c8e22b2c3f674e7499a1af779a331bd7\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><p>内部气泡</p><img src=\\\":/4a09ae5b63ce4ea69b226a97f2af7489\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><p>缺角</p><img src=\\\":/830e078b7d634bb79edba91c811a17e0\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><p>上下错位</p><img src=\\\":/5209e5526b6248ecba82ded05d4de584\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><p>溢胶</p><img src=\\\":/0c9fa1161e8245679cc10ea3bd955b95\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"627px\\\"/><p>弧度不良：焊线冲歪率大于20%</p><p>碰线不良：线与线的距离小于2倍线径、断线、接触芯片或外引脚</p><img src=\\\":/ad33710a98f64157bbd1e59c900f59b6\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><p>C-SAM 检查</p><p><b>后成型固化 Post Mold Cure：</b></p><img src=\\\":/397f8e9235d84009af21a5e18190fce6\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"674px\\\"/><p>固化烤箱Oven</p><p>后固化目的：提高材料的交联密度；缓释制造应力。</p><p>后固化温度：通常在175度左右（接近Tg温度，分子链相对松弛；催化剂的活性较高。）</p><p>后固化时间：4-8H，通常恒温6H（后固化烘箱温度均匀性；后固化烘箱的升温速度。）</p><table style=\\\"--en-fitwindow:false;border-left:1px solid #d9d9d9;border-top:1px solid #d9d9d9;border-collapse:collapse;width:380px;\\\" width=\\\"380px\\\"><colgroup><col style=\\\"width: 190px;\\\"></col><col style=\\\"width: 190px;\\\"></col></colgroup><tbody><tr><td style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>Machine</p></td><td style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>C-Sun</p></td></tr><tr><td style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>Material</p></td><td style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>NA</p></td></tr><tr><td rowspan=\\\"2\\\" style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>Control</p></td><td style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>Cure temp.</p></td></tr><tr><td style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>Cure time</p></td></tr><tr><td style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>Check</p></td><td style=\\\"--en-typeInfo:{&quot;type&quot;:&quot;text&quot;,&quot;data&quot;:{}};border-right:1px solid #d9d9d9;border-bottom:1px solid #d9d9d9;padding:10px;\\\"><p>Profile</p></td></tr></tbody></table><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div style=\\\"padding-left:200px;\\\"><br/></div><div style=\\\"padding-left:200px;\\\"><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><div><br/></div><p><b>激光打标Laser Marking：</b></p><p>目的 Purpose:</p><p>Provide a permanent identification on product body</p><p>在芯片产品的本体上刻印上永久性标识</p><img src=\\\":/39b56c42de4a49e6bec92fd38317e910\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><img src=\\\":/4cfbb3480c0845b4acbbd698df426d8b\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><img src=\\\":/1cab850922204aa5a3085a0bd843329c\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><img src=\\\":/8893627d64b34fae9b57971eb72980e3\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><p><b>去除垃圾De-junk：</b></p><p>目的 Purpose:</p><p>Remove the dam-bar of leadframe</p><p>移除拆卸引线框的阻尼条</p><img src=\\\":/2a1eba818e8a4ba89eb20b00e00c644e\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><img src=\\\":/5c925b01607d40a0acd465592d38bd5f\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><img src=\\\":/10d69933afd84a06b45bc804ab890022\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"462px\\\"/><p><b>去除飞边 De-flash：</b></p><p>目的 Purpose:</p><p>Remove the residue of EMC around the package body and lead</p><p>清除封装本体和引线周围的EMC残留物</p><p>毛刺飞边是指封装过程中塑封料树脂溢出，贴带毛边，引线毛刺等飞边毛刺现象</p><img src=\\\":/5c1c05ecd08b4d4ea67d5228c4c3ac54\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><img src=\\\":/5c1107859620485fac890c2b627115a7\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><img src=\\\":/c8c55670fe0b4f27b6428a3018650c1c\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"467px\\\"/><img src=\\\":/3375a43bb54349e489d1a42d61e92168\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><p>控制项目：软化时间，软化液温度；电解电流，电解液浓度；高压水压力，传送速度</p><p><b>电镀 Plating</b>：</p><p>Purpose:</p><p>To plating Sn on the lead which will mount on board pad.</p><p>利用金属和化学的方法，在框架表面镀上一层镀层，以防止外界环境的影响(潮湿和热），并使元器件在PCB板上容易焊接及提高导电性。</p><img src=\\\":/12caf5b897f2487aa330771515bf150d\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><img src=\\\":/1aa6f197f6774d24962f80edfca351d9\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><img src=\\\":/7c2b88bf0a674929853351de783bdaba\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><img src=\\\":/5c548fbfd9974c3497bfce292d38f7fb\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><p><b>电镀两种类型：</b></p><p>Pb—Free：无铅电镀，锡（Tin）的纯度&gt;99.95%,符合Rohs的要求；</p><p>Tin-Lead：铅锡合金。Tin占85%，Lead占15%，由于不符合Rohs，目前基本被淘汰。</p><p><b>(电镀退火）Baking after plating:</b></p><p>目的：让无铅电镀后的产品在高温下烘烤一段时间，以便消除电镀层潜在的锡须生长（Whisker Growth）的问题。</p><p>条件：150+/-5C;2Hrs</p><img src=\\\":/47a9b52381a447d2ad568461b300976a\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><p>晶须（Whisker），是指锡在长时间的潮湿环境和温度变化的环境下生长出的一种须状晶体，可能导致产品引脚的短路。</p><p>质量控制Quality Control：</p><img src=\\\":/4bf94ee0973a47e1906713d437df2f49\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"607px\\\"/><p>外观检查</p><img src=\\\":/f014f549d85e4d08afbb35318193af68\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><p>镀层厚度量测</p><img src=\\\":/39176df14bf74ead92d1f71a73d9274a\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><p>可焊性测试Solderability test</p><p>Preconditioning:  Steam aging  93℃+3℃/-5℃, 8 hrs</p><p>Solder dip:  SnAgCu 245℃±5℃, 5±0.5s</p><p>solder coverage≥95%</p><p><b>修形Trim Form：</b></p><p>Purpose:</p><p>Remove the tie-bar and lead-frame and form products to units from strips, fill them into tubes and then pass to next process.</p><p>拆下拉杆和引线框架，将带材成型成件，装入管材，然后进入下一道工序。</p><img src=\\\":/66dd7842a06d4fc59dcd430da3bba003\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><img src=\\\":/eeb366d8dd904854b237a998a7039887\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"448px\\\"/><img src=\\\":/77acde74e8bc4a34952dcc87f1510fa8\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><p><b>质量控制 Quality Control</b>：</p><p>外观检查</p><img src=\\\":/df11b9bb290049b9b4aa98ee7b5ff1f5\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><img src=\\\":/5517780b2f114560864f54b9645e10c4\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><p><b>外形尺寸量测：</b></p><img src=\\\":/8b6395e7641d41648a8521d229d257f9\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><img src=\\\":/ab54cf22eb024c6297c8ec68dcc5e6c7\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><p><b>包装 Packing：</b></p><p>目的 Purpose:</p><p>Protect the product in the circulation process, convenient storage and transportation</p><p>保护产品在流通过程中，方便储运</p><img src=\\\":/c9f72d6080eb4de5adedd2fd3cd8d847\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><img src=\\\":/6835b7024df94227ab0635ab21472c6c\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"681px\\\"/><p>文章来源于：SMT之家</p><img src=\\\":/e7051b08d66e442d8aaa02faa2eeabcc\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\"/><ul><li><div><br/></div><div><b>小编小语</b></div></li><li><div><br/></div><div><span style=\\\"font-weight: 700;\\\">大量读者还没有养成阅读后点赞的习惯，希望大家阅读后顺手点“</span></div></li></ul><img src=\\\":/01e6d8aad1fc4049aa6c42440903b3eb\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"23px\\\"/><ul><li><div><br/></div><div><span style=\\\"font-weight: 700;\\\">在看”并分享到朋友圈，以示鼓励！坚持是一种信仰，专注是一种态度！</span></div><div><b>免责声明：本公众号所载文章为本公众号原创或根据网络搜集编辑整理，文章版权归原作者所有。如涉及作品内容、版权和其它问题，请跟我们联系！文章内容为作者个人观点,并不代表本公众号赞同或支持其观点。本公众号拥有对此声明的最终解释权。</b></div></li></ul><img src=\\\":/0cdc8cb590b340be94c47b25532df678\\\" type=\\\"image/jpeg\\\" data-filename=\\\"Image.jpg\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"autopx\\\"/><img src=\\\":/a8407a5d18054906b8339ff5abfa6aef\\\" type=\\\"image/gif\\\" data-filename=\\\"Image.gif\\\" style=\\\"--en-uploadstate:uploaded;\\\" width=\\\"autopx\\\"/><ul><li><div><br/></div><div><br/></div></li></ul><img src=\\\":/150b80f1c9e44994b7da8b8e4be0bbc2\\\" type=\\\"image/png\\\" data-filename=\\\"Image.png\\\" style=\\\"--en-uploadstate:uploaded;\\\"/><div><br/></div></span>\\\n</div></body></html>\\u0000\"]],\"start1\":0,\"start2\":0,\"length1\":0,\"length2\":37928}]"
metadata_diff: {"new":{"id":"0f242382aa9143ac9c86621925ae1df8","parent_id":"061de1401cfc4cfaadf6e74e015970e9","latitude":"0.00000000","longitude":"0.00000000","altitude":"0.0000","author":"","source_url":"","is_todo":0,"todo_due":0,"todo_completed":0,"source":"joplin-desktop","source_application":"net.cozic.joplin-desktop","application_data":"","order":1764345872731,"markup_language":2,"is_shared":0,"share_id":"","conflict_original_id":"","master_key_id":"","user_data":"","deleted_time":0},"deleted":[]}
encryption_cipher_text: 
encryption_applied: 0
updated_time: 2025-11-28T16:20:23.950Z
created_time: 2025-11-28T16:20:23.950Z
type_: 13