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body_diff: "[{\"diffs\":[[1,\"<html>\\\r\\\n<head>\\\r\\\n  <title>第三代半导体之SiC研究框架专题报告(35页附下载)</title>\\\r\\\n  <basefont face=\\\"微软雅黑\\\" size=\\\"2\\\" />\\\r\\\n  <meta http-equiv=\\\"Content-Type\\\" content=\\\"text/html;charset=utf-8\\\" />\\\r\\\n  <meta name=\\\"exporter-version\\\" content=\\\"YXBJ Windows/608924 (zh-CN, DDL); Windows/10.0.0 (Win64); EDAMVersion=V2;\\\"/>\\\r\\\n  <style>\\\r\\\n\\tbody, td {\\\r\\\n\\t  font-family: 微软雅黑;\\\r\\\n\\t  font-size: 12pt;\\\r\\\n\\t}\\\r\\\n  </style>\\\r\\\n</head>\\\r\\\n<body>\\\r\\\n<a name=\\\"30844\\\"></a>\\\r\\\n<h1>第三代半导体之SiC研究框架专题报告(35页附下载)</h1>\\\r\\\n\\\r\\\n<div><span style=\\\"margin:0px;\\\"><div style=\\\"padding:8px 0px;margin:8px auto;max-width:700px;\\\"> <div><div><div><h1 style=\\\"margin:0\\\"> 第三代半导体之SiC研究框架专题报告(35页附下载) </h1><div><span><a style=\\\"position:relative\\\"> 集成电路前沿 </a></span><em></em></div><div style=\\\"__visibility: hidden;\\\"><p style=\\\"margin:0;text-align:center;margin-bottom:0\\\"><img src=\\\"第三代半导体之SiC研究框架专题报告(35页附下载)_files/640.jpg\\\" type=\\\"image/jpeg\\\" data-filename=\\\"640.jpg\\\" style=\\\"\\\"/></p><p style=\\\"margin:0;margin-bottom:0\\\"><span style=\\\"font-size: 16px;\\\"></span></p><p style=\\\"margin:0;outline:0;max-width:100%;color:rgb(34,34,34);font-family:system-ui,-apple-system,BlinkMacSystemFont,&quot;Helvetica Neue&quot;,&quot;PingFang SC&quot;,&quot;Hiragino Sans GB&quot;,&quot;Microsoft YaHei UI&quot;,&quot;Microsoft YaHei&quot;,Arial,sans-serif;letter-spacing:0.544px;white-space:normal;background-color:rgb(255,255,255);text-align:center;__visibility:visible;box-sizing:border-box !important;overflow-wrap:break-word !important\\\"><img src=\\\"第三代半导体之SiC研究框架专题报告(35页附下载)_files/640 [1].jpg\\\" type=\\\"image/jpeg\\\" data-filename=\\\"640.jpg\\\" style=\\\"outline: 0px;display: initial;box-sizing: border-box !important;overflow-wrap: break-word !important;__visibility: visible !important;width: 677px !important;\\\"/></p><p style=\\\"margin:0;outline:0;max-width:100%;color:rgb(34,34,34);font-family:system-ui,-apple-system,BlinkMacSystemFont,&quot;Helvetica Neue&quot;,&quot;PingFang SC&quot;,&quot;Hiragino Sans GB&quot;,&quot;Microsoft YaHei UI&quot;,&quot;Microsoft YaHei&quot;,Arial,sans-serif;letter-spacing:0.544px;white-space:normal;background-color:rgb(255,255,255);text-align:center;__visibility:visible;box-sizing:border-box !important;overflow-wrap:break-word !important;margin-bottom:0\\\"><img src=\\\"第三代半导体之SiC研究框架专题报告(35页附下载)_files/640 [2].jpg\\\" type=\\\"image/jpeg\\\" data-filename=\\\"640.jpg\\\" style=\\\"outline: 0px;display: initial;box-sizing: border-box !important;overflow-wrap: break-word !important;__visibility: visible !important;width: 677px !important;\\\"/></p><p style=\\\"margin:0;outline:0;max-width:100%;color:rgb(34,34,34);font-family:system-ui,-apple-system,BlinkMacSystemFont,&quot;Helvetica Neue&quot;,&quot;PingFang SC&quot;,&quot;Hiragino Sans GB&quot;,&quot;Microsoft YaHei UI&quot;,&quot;Microsoft YaHei&quot;,Arial,sans-serif;letter-spacing:0.544px;white-space:normal;background-color:rgb(255,255,255);text-align:center;__visibility:visible;box-sizing:border-box !important;overflow-wrap:break-word !important;margin-bottom:0\\\"><img src=\\\"第三代半导体之SiC研究框架专题报告(35页附下载)_files/640 [3].jpg\\\" type=\\\"image/jpeg\\\" data-filename=\\\"640.jpg\\\" style=\\\"outline: 0px;display: initial;box-sizing: border-box !important;overflow-wrap: break-word !important;__visibility: visible !important;width: 677px !important;\\\"/></p><p style=\\\"margin:0;outline:0;max-width:100%;color:rgb(34,34,34);font-family:system-ui,-apple-system,BlinkMacSystemFont,&quot;Helvetica Neue&quot;,&quot;PingFang SC&quot;,&quot;Hiragino Sans GB&quot;,&quot;Microsoft YaHei UI&quot;,&quot;Microsoft YaHei&quot;,Arial,sans-serif;letter-spacing:0.544px;white-space:normal;background-color:rgb(255,255,255);text-align:center;__visibility:visible;box-sizing:border-box !important;overflow-wrap:break-word !important;margin-bottom:0\\\"><img src=\\\"第三代半导体之SiC研究框架专题报告(35页附下载)_files/640 [4].jpg\\\" type=\\\"image/jpeg\\\" data-filename=\\\"640.jpg\\\" style=\\\"outline: 0px;display: initial;box-sizing: border-box !important;overflow-wrap: break-word !important;__visibility: visible !important;width: 677px !important;\\\"/></p><p style=\\\"margin:0;outline:0;max-width:100%;color:rgb(34,34,34);font-family:system-ui,-apple-system,BlinkMacSystemFont,&quot;Helvetica Neue&quot;,&quot;PingFang SC&quot;,&quot;Hiragino Sans GB&quot;,&quot;Microsoft YaHei UI&quot;,&quot;Microsoft YaHei&quot;,Arial,sans-serif;letter-spacing:0.544px;white-space:normal;background-color:rgb(255,255,255);text-align:center;__visibility:visible;box-sizing:border-box !important;overflow-wrap:break-word !important;margin-bottom:0\\\"><img src=\\\"第三代半导体之SiC研究框架专题报告(35页附下载)_files/640 [5].jpg\\\" type=\\\"image/jpeg\\\" data-filename=\\\"640.jpg\\\" style=\\\"outline: 0px;display: initial;box-sizing: border-box !important;overflow-wrap: break-word !important;__visibility: visible !important;width: 677px !important;\\\"/></p><p style=\\\"margin:0;outline:0;max-width:100%;color:rgb(34,34,34);font-family:system-ui,-apple-system,BlinkMacSystemFont,&quot;Helvetica Neue&quot;,&quot;PingFang SC&quot;,&quot;Hiragino Sans GB&quot;,&quot;Microsoft YaHei UI&quot;,&quot;Microsoft YaHei&quot;,Arial,sans-serif;letter-spacing:0.544px;white-space:normal;background-color:rgb(255,255,255);text-align:center;__visibility:visible;box-sizing:border-box !important;overflow-wrap:break-word !important;margin-bottom:0\\\"><img src=\\\"第三代半导体之SiC研究框架专题报告(35页附下载)_files/640 [6].jpg\\\" type=\\\"image/jpeg\\\" data-filename=\\\"640.jpg\\\" style=\\\"outline: 0px;display: initial;box-sizing: border-box !important;overflow-wrap: break-word !important;__visibility: visible !important;width: 677px !important;\\\"/></p><p 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style=\\\"margin:0;outline:0;max-width:100%;color:rgb(34,34,34);font-family:system-ui,-apple-system,BlinkMacSystemFont,&quot;Helvetica Neue&quot;,&quot;PingFang SC&quot;,&quot;Hiragino Sans GB&quot;,&quot;Microsoft YaHei UI&quot;,&quot;Microsoft YaHei&quot;,Arial,sans-serif;letter-spacing:0.544px;white-space:normal;background-color:rgb(255,255,255);text-align:center;__visibility:visible;box-sizing:border-box !important;overflow-wrap:break-word !important;margin-bottom:0\\\"><img src=\\\"第三代半导体之SiC研究框架专题报告(35页附下载)_files/640 [12].jpg\\\" type=\\\"image/jpeg\\\" data-filename=\\\"640.jpg\\\" style=\\\"outline: 0px;display: initial;box-sizing: border-box !important;overflow-wrap: break-word !important;__visibility: visible !important;width: 677px !important;\\\"/></p><p style=\\\"margin:0;outline:0;max-width:100%;color:rgb(34,34,34);font-family:system-ui,-apple-system,BlinkMacSystemFont,&quot;Helvetica Neue&quot;,&quot;PingFang SC&quot;,&quot;Hiragino Sans GB&quot;,&quot;Microsoft YaHei UI&quot;,&quot;Microsoft YaHei&quot;,Arial,sans-serif;letter-spacing:0.544px;white-space:normal;background-color:rgb(255,255,255);text-align:center;__visibility:visible;box-sizing:border-box !important;overflow-wrap:break-word !important;margin-bottom:0\\\"><img src=\\\"第三代半导体之SiC研究框架专题报告(35页附下载)_files/640 [13].jpg\\\" type=\\\"image/jpeg\\\" data-filename=\\\"640.jpg\\\" style=\\\"outline: 0px;display: initial;box-sizing: border-box !important;overflow-wrap: break-word !important;__visibility: visible !important;width: 677px !important;\\\"/></p><p style=\\\"margin:0;outline:0;max-width:100%;color:rgb(34,34,34);font-family:system-ui,-apple-system,BlinkMacSystemFont,&quot;Helvetica Neue&quot;,&quot;PingFang SC&quot;,&quot;Hiragino Sans GB&quot;,&quot;Microsoft YaHei UI&quot;,&quot;Microsoft YaHei&quot;,Arial,sans-serif;letter-spacing:0.544px;white-space:normal;background-color:rgb(255,255,255);text-align:center;__visibility:visible;box-sizing:border-box !important;overflow-wrap:break-word !important;margin-bottom:0\\\"><img src=\\\"第三代半导体之SiC研究框架专题报告(35页附下载)_files/640 [14].jpg\\\" type=\\\"image/jpeg\\\" data-filename=\\\"640.jpg\\\" style=\\\"outline: 0px;display: initial;box-sizing: border-box !important;overflow-wrap: break-word !important;__visibility: visible !important;width: 677px !important;\\\"/></p><p style=\\\"margin:0;outline:0;max-width:100%;color:rgb(34,34,34);font-family:system-ui,-apple-system,BlinkMacSystemFont,&quot;Helvetica Neue&quot;,&quot;PingFang SC&quot;,&quot;Hiragino Sans GB&quot;,&quot;Microsoft YaHei UI&quot;,&quot;Microsoft YaHei&quot;,Arial,sans-serif;letter-spacing:0.544px;white-space:normal;background-color:rgb(255,255,255);text-align:center;__visibility:visible;box-sizing:border-box !important;overflow-wrap:break-word !important;margin-bottom:0\\\"><img src=\\\"第三代半导体之SiC研究框架专题报告(35页附下载)_files/640 [15].jpg\\\" type=\\\"image/jpeg\\\" data-filename=\\\"640.jpg\\\" style=\\\"outline: 0px;display: initial;box-sizing: border-box !important;overflow-wrap: break-word !important;__visibility: visible !important;width: 677px !important;\\\"/></p><p style=\\\"margin:0;outline:0;max-width:100%;color:rgb(34,34,34);font-family:system-ui,-apple-system,BlinkMacSystemFont,&quot;Helvetica Neue&quot;,&quot;PingFang SC&quot;,&quot;Hiragino Sans GB&quot;,&quot;Microsoft YaHei UI&quot;,&quot;Microsoft YaHei&quot;,Arial,sans-serif;letter-spacing:0.544px;white-space:normal;background-color:rgb(255,255,255);text-align:center;__visibility:visible;box-sizing:border-box !important;overflow-wrap:break-word !important;margin-bottom:0\\\"><img src=\\\"第三代半导体之SiC研究框架专题报告(35页附下载)_files/640 [16].jpg\\\" type=\\\"image/jpeg\\\" data-filename=\\\"640.jpg\\\" style=\\\"outline: 0px;display: initial;box-sizing: border-box !important;overflow-wrap: break-word !important;__visibility: visible !important;width: 677px !important;\\\"/></p><p style=\\\"margin:0;outline:0;max-width:100%;color:rgb(34,34,34);font-family:system-ui,-apple-system,BlinkMacSystemFont,&quot;Helvetica Neue&quot;,&quot;PingFang SC&quot;,&quot;Hiragino Sans GB&quot;,&quot;Microsoft YaHei UI&quot;,&quot;Microsoft YaHei&quot;,Arial,sans-serif;letter-spacing:0.544px;white-space:normal;background-color:rgb(255,255,255);text-align:center;__visibility:visible;box-sizing:border-box !important;overflow-wrap:break-word !important;margin-bottom:0\\\"><img src=\\\"第三代半导体之SiC研究框架专题报告(35页附下载)_files/640 [17].jpg\\\" type=\\\"image/jpeg\\\" data-filename=\\\"640.jpg\\\" style=\\\"outline: 0px;display: initial;box-sizing: border-box !important;overflow-wrap: break-word !important;__visibility: visible !important;width: 677px !important;\\\"/></p><p style=\\\"margin:0;outline:0;max-width:100%;color:rgb(34,34,34);font-family:system-ui,-apple-system,BlinkMacSystemFont,&quot;Helvetica Neue&quot;,&quot;PingFang SC&quot;,&quot;Hiragino Sans GB&quot;,&quot;Microsoft YaHei UI&quot;,&quot;Microsoft YaHei&quot;,Arial,sans-serif;letter-spacing:0.544px;white-space:normal;background-color:rgb(255,255,255);text-align:center;__visibility:visible;box-sizing:border-box !important;overflow-wrap:break-word !important;margin-bottom:0\\\"><img src=\\\"第三代半导体之SiC研究框架专题报告(35页附下载)_files/640 [18].jpg\\\" type=\\\"image/jpeg\\\" data-filename=\\\"640.jpg\\\" style=\\\"outline: 0px;display: initial;box-sizing: border-box !important;overflow-wrap: break-word !important;__visibility: visible !important;width: 677px !important;\\\"/></p><p style=\\\"margin:0;outline:0;max-width:100%;color:rgb(34,34,34);font-family:system-ui,-apple-system,BlinkMacSystemFont,&quot;Helvetica Neue&quot;,&quot;PingFang SC&quot;,&quot;Hiragino Sans GB&quot;,&quot;Microsoft YaHei UI&quot;,&quot;Microsoft YaHei&quot;,Arial,sans-serif;letter-spacing:0.544px;white-space:normal;background-color:rgb(255,255,255);text-align:center;__visibility:visible;box-sizing:border-box !important;overflow-wrap:break-word !important;margin-bottom:0\\\"><img src=\\\"第三代半导体之SiC研究框架专题报告(35页附下载)_files/640 [19].jpg\\\" type=\\\"image/jpeg\\\" data-filename=\\\"640.jpg\\\" style=\\\"outline: 0px;display: initial;box-sizing: border-box !important;overflow-wrap: break-word !important;__visibility: visible !important;width: 677px !important;\\\"/></p><p style=\\\"margin:0;outline:0;max-width:100%;color:rgb(34,34,34);font-family:system-ui,-apple-system,BlinkMacSystemFont,&quot;Helvetica Neue&quot;,&quot;PingFang SC&quot;,&quot;Hiragino Sans GB&quot;,&quot;Microsoft YaHei UI&quot;,&quot;Microsoft YaHei&quot;,Arial,sans-serif;letter-spacing:0.544px;white-space:normal;background-color:rgb(255,255,255);text-align:center;__visibility:visible;box-sizing:border-box !important;overflow-wrap:break-word !important;margin-bottom:0\\\"><img src=\\\"第三代半导体之SiC研究框架专题报告(35页附下载)_files/640 [20].jpg\\\" type=\\\"image/jpeg\\\" data-filename=\\\"640.jpg\\\" style=\\\"outline: 0px;display: initial;box-sizing: border-box !important;overflow-wrap: break-word !important;__visibility: visible !important;width: 677px !important;\\\"/></p><p style=\\\"margin:0;outline:0;max-width:100%;color:rgb(34,34,34);font-family:system-ui,-apple-system,BlinkMacSystemFont,&quot;Helvetica Neue&quot;,&quot;PingFang SC&quot;,&quot;Hiragino Sans GB&quot;,&quot;Microsoft YaHei UI&quot;,&quot;Microsoft YaHei&quot;,Arial,sans-serif;letter-spacing:0.544px;white-space:normal;background-color:rgb(255,255,255);text-align:left;__visibility:visible;box-sizing:border-box !important;overflow-wrap:break-word !important\\\"><span style=\\\"outline: 0px;max-width: 100%;color: rgb(136, 136, 136);font-size: 14px;text-align: justify;__visibility: visible;box-sizing: border-box !important;overflow-wrap: break-word !important;\\\">来源：方正证券    作者：陈杭</span><br style=\\\"outline: 0px;max-width: 100%;__visibility: visible;box-sizing: border-box !important;overflow-wrap: break-word !important;\\\"/></p><p style=\\\"margin:0;outline:0;max-width:100%;color:rgb(34,34,34);font-family:system-ui,-apple-system,BlinkMacSystemFont,&quot;Helvetica Neue&quot;,&quot;PingFang SC&quot;,&quot;Hiragino Sans GB&quot;,&quot;Microsoft YaHei UI&quot;,&quot;Microsoft YaHei&quot;,Arial,sans-serif;letter-spacing:0.544px;white-space:normal;background-color:rgb(255,255,255);__visibility:visible;box-sizing:border-box !important;overflow-wrap:break-word !important\\\"><span style=\\\"outline: 0px;max-width: 100%;color: rgb(136, 136, 136);font-size: 14px;__visibility: visible;box-sizing: border-box !important;overflow-wrap: break-word !important;\\\">（以上文章系转载，仅供个人学习，如有涉及版权等问题，请联系小编进行处理）    </span></p><p style=\\\"margin:0;outline:0;max-width:100%;font-family:-apple-system,BlinkMacSystemFont,&quot;Helvetica Neue&quot;,&quot;PingFang SC&quot;,&quot;Hiragino Sans GB&quot;,&quot;Microsoft YaHei UI&quot;,&quot;Microsoft YaHei&quot;,Arial,sans-serif;letter-spacing:0.544px;white-space:normal;background-color:rgb(255,255,255);text-align:center;margin-bottom:0;box-sizing:border-box !important;overflow-wrap:break-word !important\\\"><img src=\\\"第三代半导体之SiC研究框架专题报告(35页附下载)_files/640.png\\\" type=\\\"image/png\\\" data-filename=\\\"640.png\\\" style=\\\"outline: 0px;box-sizing: border-box !important;overflow-wrap: break-word !important;__visibility: visible !important;width: 223px !important;\\\"/></p><div style=\\\"outline: 0px;max-width: 100%;font-family: -apple-system, BlinkMacSystemFont, &quot;Helvetica Neue&quot;, &quot;PingFang SC&quot;, &quot;Hiragino Sans GB&quot;, &quot;Microsoft YaHei UI&quot;, &quot;Microsoft YaHei&quot;, Arial, sans-serif;letter-spacing: 0.544px;white-space: normal;background-color: rgb(255, 255, 255);line-height: 1.75em;text-align: center;box-sizing: border-box !important;overflow-wrap: break-word !important;margin-bottom: 0px;\\\"><span style=\\\"outline: 0px;max-width: 100%;font-size: 14px;background-color: rgb(255, 251, 0);box-sizing: border-box !important;overflow-wrap: break-word !important;\\\">扫码加我，拉您进集成电路专业微信群</span></div><p style=\\\"margin:0;outline:0;max-width:100%;color:rgb(34,34,34);font-family:-apple-system,BlinkMacSystemFont,&quot;Helvetica Neue&quot;,&quot;PingFang SC&quot;,&quot;Hiragino Sans GB&quot;,&quot;Microsoft YaHei UI&quot;,&quot;Microsoft YaHei&quot;,Arial,sans-serif;letter-spacing:0.544px;white-space:normal;background-color:rgb(255,255,255);text-align:center;box-sizing:border-box !important;overflow-wrap:break-word !important;margin-bottom:0\\\"><br/></p><div style=\\\"white-space: normal;color: rgb(62, 62, 62);font-size: 16px;background-color: rgb(255, 255, 255);max-width: 100%;box-sizing: border-box;min-height: 1em;text-align: center;overflow-wrap: break-word !important;margin-bottom: 0px;\\\"><em><span style=\\\"font-size: 12px;\\\"><em style=\\\"max-width: 100%;color: rgb(62, 62, 62);font-family: -apple-system, BlinkMacSystemFont, &quot;Helvetica Neue&quot;, &quot;PingFang SC&quot;, &quot;Hiragino Sans GB&quot;, &quot;Microsoft YaHei UI&quot;, &quot;Microsoft YaHei&quot;, Arial, sans-serif;font-size: 16px;letter-spacing: 0.544px;white-space: normal;box-sizing: border-box !important;overflow-wrap: break-word !important;\\\"><span style=\\\"max-width: 100%;font-size: 12px;box-sizing: border-box !important;overflow-wrap: break-word !important;\\\"><em style=\\\"max-width: 100%;font-size: 16px;box-sizing: border-box !important;overflow-wrap: break-word !important;\\\"><span style=\\\"max-width: 100%;font-size: 12px;box-sizing: border-box !important;overflow-wrap: break-word !important;\\\">——END——</span></em></span></em></span></em></div><p style=\\\"margin:0;white-space:normal;color:rgb(62,62,62);font-size:16px;background-color:rgb(255,255,255);max-width:100%;box-sizing:border-box;min-height:1em;overflow-wrap:break-word !important;margin-bottom:0\\\"><em><span style=\\\"font-size: 12px;\\\"><em style=\\\"max-width: 100%;color: rgb(62, 62, 62);font-family: -apple-system, BlinkMacSystemFont, &quot;Helvetica Neue&quot;, &quot;PingFang SC&quot;, &quot;Hiragino Sans GB&quot;, &quot;Microsoft YaHei UI&quot;, &quot;Microsoft YaHei&quot;, Arial, sans-serif;font-size: 16px;letter-spacing: 0.544px;white-space: normal;box-sizing: border-box !important;overflow-wrap: break-word !important;\\\"><span style=\\\"max-width: 100%;font-size: 12px;box-sizing: border-box !important;overflow-wrap: break-word !important;\\\"><em style=\\\"max-width: 100%;font-size: 16px;box-sizing: border-box !important;overflow-wrap: break-word !important;\\\"><span style=\\\"max-width: 100%;font-size: 12px;box-sizing: border-box !important;overflow-wrap: break-word !important;\\\">免责声明：本文内容来源于网络，除原创作品，本平台所使用的文章、图片等相关内容，属原权利人所有。集成电路前沿转载仅作为行业信息及新闻分享，不代表集成电路前沿支持或赞同本文观点，若有任何异议或侵权，敬请联系集成电路前沿，我们会及时处理，谢谢！</span></em></span></em></span></em></p><p 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href=\\\"http://mp.weixin.qq.com/s?__biz=Mzg5OTU3NTc0Nw==&amp;mid=2247498892&amp;idx=1&amp;sn=266bf1dde9bb547fe79649e07a0266f7&amp;chksm=c0538620f7240f364ea8e3b46164b236b98cbe624451ea4c219c4348d12a683b76f09d96da7c&amp;scene=21#wechat_redirect\\\" target=\\\"_blank\\\"></a><a href=\\\"http://mp.weixin.qq.com/s?__biz=Mzg5OTU3NTc0Nw==&amp;mid=2247503379&amp;idx=5&amp;sn=b9bff57165ef9de41abd309c2acd5c9f&amp;chksm=c053b4bff7243da9319a2061f17b158ab515c68cd651fb92eac0c56252cff8701a307f7899af&amp;scene=21#wechat_redirect\\\" target=\\\"_blank\\\">重大福利：推荐你加入集成电路技术交流群！</a></p></li></ol><p style=\\\"margin:0;white-space:normal;color:rgb(62,62,62);font-size:16px;background-color:rgb(255,255,255);max-width:100%;min-height:1em;box-sizing:border-box !important;overflow-wrap:break-word !important;margin-bottom:0\\\"><br/></p><table><tbody><tr><td style=\\\"word-break: break-all;\\\" valign=\\\"top\\\" width=\\\"559\\\"><p style=\\\"margin:0\\\"><span style=\\\"color: rgb(53, 53, 53);font-size: 14px;text-align: left;background-color: rgb(165, 200, 255);\\\">集成电路前沿每日为大家奉上最新的集成电路行业资讯，欢迎扫描下方二维码关注</span></p><p style=\\\"margin:0;text-align:center\\\"><img src=\\\"第三代半导体之SiC研究框架专题报告(35页附下载)_files/640 [22].jpg\\\" type=\\\"image/jpeg\\\" data-filename=\\\"640.jpg\\\" style=\\\"height: 119px;width: 107px;\\\"/></p></td></tr></tbody></table><p style=\\\"margin:0;white-space:normal;text-align:center;margin-bottom:0\\\"><img src=\\\"第三代半导体之SiC研究框架专题报告(35页附下载)_files/640 [23].jpg\\\" type=\\\"image/jpeg\\\" data-filename=\\\"640.jpg\\\" style=\\\"\\\"/></p><div style=\\\"margin-top: 5px;margin-bottom: 5px;white-space: normal;text-align: left;text-indent: 2em;\\\"><br/></div><p style=\\\"margin:0\\\"><br/></p></div></div></div></div></div></span>\\\n</div></body></html>\\u0000\"]],\"start1\":0,\"start2\":0,\"length1\":0,\"length2\":32947}]"
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