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title_diff: "[{\"diffs\":[[1,\"半导体封测术语\"]],\"start1\":0,\"start2\":0,\"length1\":0,\"length2\":7}]"
body_diff: "[{\"diffs\":[[1,\"<html>\\\r\\\n<head>\\\r\\\n  <title>半导体封测术语</title>\\\r\\\n  <basefont face=\\\"微软雅黑\\\" size=\\\"2\\\" />\\\r\\\n  <meta http-equiv=\\\"Content-Type\\\" content=\\\"text/html;charset=utf-8\\\" />\\\r\\\n  <meta name=\\\"exporter-version\\\" content=\\\"YXBJ Windows/608924 (zh-CN, DDL); Windows/10.0.0 (Win64); EDAMVersion=V2;\\\"/>\\\r\\\n  <style>\\\r\\\n\\tbody, td {\\\r\\\n\\t  font-family: 微软雅黑;\\\r\\\n\\t  font-size: 12pt;\\\r\\\n\\t}\\\r\\\n  </style>\\\r\\\n</head>\\\r\\\n<body>\\\r\\\n<a name=\\\"17190\\\"></a>\\\r\\\n<h1>半导体封测术语</h1>\\\r\\\n\\\r\\\n<div>\\\n<span><div><table style=\\\"border-collapse: collapse; min-width: 100%;\\\"><colgroup><col style=\\\"width: 130px;\\\"></col><col style=\\\"width: 130px;\\\"></col><col style=\\\"width: 455px;\\\"></col></colgroup><tbody><tr><td style=\\\"width: 130px; padding: 8px; border: 1px solid rgb(204, 204, 204);\\\"><div>英文</div></td><td style=\\\"width: 130px; padding: 8px; border: 1px solid rgb(204, 204, 204);\\\"><div>中文</div></td><td style=\\\"width: 455px; padding: 8px; border: 1px solid rgb(204, 204, 204);\\\"><div>说明</div></td></tr><tr><td style=\\\"width: 130px; padding: 8px; border: 1px solid rgb(204, 204, 204);\\\"><div><span style=\\\"line-height: 1.45;\\\">Die Saw</span></div></td><td style=\\\"width: 130px; padding: 8px; border: 1px solid rgb(204, 204, 204);\\\"><div><span style=\\\"line-height: 1.45;\\\">晶圆切割</span></div></td><td style=\\\"width: 455px; padding: 8px; border: 1px solid rgb(204, 204, 204);\\\"><div><span>晶片切割之目的乃是要將前製程加工完成的晶圓上一顆顆之晶粒</span></div><div><span>（</span><span>Die</span><span>）切割分離。</span></div></td></tr><tr><td style=\\\"width: 130px; padding: 8px; border: 1px solid rgb(204, 204, 204);\\\"><div><span>Die Bond</span></div></td><td style=\\\"width: 130px; padding: 8px; border: 1px solid rgb(204, 204, 204);\\\"><div><span>黏晶</span></div></td><td style=\\\"width: 455px; padding: 8px; border: 1px solid rgb(204, 204, 204);\\\"><div><span>黏晶</span><span>的目的乃是將一顆顆分離的晶粒放置在導線架（</span><span>lead frame</span><span>）</span></div><div><span>上並用銀膠（</span> <span>epoxy</span> <span>）黏著固定</span><span>。</span></div></td></tr><tr><td style=\\\"width: 130px; padding: 8px; border: 1px solid rgb(204, 204, 204);\\\"><div><span>Wire Bond</span></div></td><td style=\\\"width: 130px; padding: 8px; border: 1px solid rgb(204, 204, 204);\\\"><div><span>銲線</span></div></td><td style=\\\"width: 455px; padding: 8px; border: 1px solid rgb(204, 204, 204);\\\"><div><span>銲線</span><span>的目的是將晶粒上的接點以極細的金線（</span><span>18~50um</span><span>）連接</span><span style=\\\"line-height: 1.45;\\\">到導線架上之內引腳，藉而將ＩＣ晶粒之電路訊號傳輸到外界。</span></div></td></tr><tr><td style=\\\"width: 130px; padding: 8px; border: 1px solid rgb(204, 204, 204);\\\"><div><span>Mold</span></div></td><td style=\\\"width: 130px; padding: 8px; border: 1px solid rgb(204, 204, 204);\\\"><div><span>封膠</span></div></td><td style=\\\"width: 455px; padding: 8px; border: 1px solid rgb(204, 204, 204);\\\"><div><span>１、防止濕氣等由外部侵入。</span></div><div><span>２、以機械方式支持導線。</span><span style=\\\"line-height: 1.45;\\\"> </span></div><div><span>３、有效地將內部產生之熱排出於外部。</span></div><div><span>４、提供能夠手持之形體。</span></div></td></tr><tr><td style=\\\"width: 130px; padding: 8px; border: 1px solid rgb(204, 204, 204);\\\"><div><span>Mark</span></div></td><td style=\\\"width: 130px; padding: 8px; border: 1px solid rgb(204, 204, 204);\\\"><div><span>印字</span></div></td><td style=\\\"width: 455px; padding: 8px; border: 1px solid rgb(204, 204, 204);\\\"><div><span>印字</span><span>的目的，在註明商品之規格及製造者。良好的印字令人有</span><span style=\\\"line-height: 1.45;\\\">高尚產品之感覺。</span></div></td></tr><tr><td style=\\\"width: 130px; padding: 8px; border: 1px solid rgb(204, 204, 204);\\\"><div><span>Trim/Form</span></div></td><td style=\\\"width: 130px; padding: 8px; border: 1px solid rgb(204, 204, 204);\\\"><div><span>剪切成型</span></div></td><td style=\\\"width: 455px; padding: 8px; border: 1px solid rgb(204, 204, 204);\\\"><div><span>封膠完後之導線架需先將導線架上多餘之殘膠去除</span><span style=\\\"line-height: 1.45;\\\">（</span><span style=\\\"line-height: 1.45;\\\">deflash</span><span style=\\\"line-height: 1.45;\\\">），並且經過電鍍（</span><span style=\\\"line-height: 1.45;\\\">plating</span><span style=\\\"line-height: 1.45;\\\">）以增加外引腳之導電性</span><span style=\\\"line-height: 1.45;\\\">及抗氧化性，而後再進行</span><span style=\\\"line-height: 1.45;\\\">剪切成型</span><span style=\\\"line-height: 1.45;\\\">。剪切之目的，乃是要將</span><span style=\\\"line-height: 1.45;\\\">整條導線架上已封裝好之晶粒，每個獨立分開。</span></div></td></tr></tbody></table><div><br/></div></div><div><br/></div></span>\\\n</div></body></html>\\u0000\"]],\"start1\":0,\"start2\":0,\"length1\":0,\"length2\":4187}]"
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updated_time: 2025-11-28T21:04:09.997Z
created_time: 2025-11-28T21:04:09.997Z
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