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body_diff: "[{\"diffs\":[[1,\"<html>\\\r\\\n<head>\\\r\\\n  <title>集成电路制造年会目标客户</title>\\\r\\\n  <basefont face=\\\"微软雅黑\\\" size=\\\"2\\\" />\\\r\\\n  <meta http-equiv=\\\"Content-Type\\\" content=\\\"text/html;charset=utf-8\\\" />\\\r\\\n  <meta name=\\\"exporter-version\\\" content=\\\"YXBJ Windows/608924 (zh-CN, DDL); Windows/10.0.0 (Win64); EDAMVersion=V2;\\\"/>\\\r\\\n  <style>\\\r\\\n\\tbody, td {\\\r\\\n\\t  font-family: 微软雅黑;\\\r\\\n\\t  font-size: 12pt;\\\r\\\n\\t}\\\r\\\n  </style>\\\r\\\n</head>\\\r\\\n<body>\\\r\\\n<a name=\\\"21949\\\"></a>\\\r\\\n<h1>集成电路制造年会目标客户</h1>\\\r\\\n\\\r\\\n<div><span><div><span style=\\\"background-color: rgb(255, 250, 165);-evernote-highlight:true;\\\">10:35-11:00\\t联电完整的工艺技术及制造解决方案\\\n</span></div><div><span style=\\\"background-color: rgb(255, 250, 165);-evernote-highlight:true;\\\">UMC Advanced Specialty Technologies\\t林伟圣 和舰芯片制造（苏州）股份有限公司副总经理\\\n</span></div><div><span style=\\\"background-color: rgb(255, 250, 165);-evernote-highlight:true;\\\">W S LIN, Sales VP, HeJian Technology (Suzhou) Co., Ltd.\\\n</span></div><div><br/></div><div>10:00-10:20\\t敏芯股份：国内MEMS全产业链研发，全产业链本土化的践行者\\\n</div><div>Memsensing：a pioneer of China MEMS industry chain development, integration and localization\\t李刚 苏州敏芯微电子技术股份有限公司CEO\\\n</div><div>Gary LI, CEO of Suzhou Memsensing Microsystems Co., Ltd\\\n</div><div><br/></div><div><span style=\\\"background-color: rgb(255, 250, 165);-evernote-highlight:true;\\\">11:20-11:40\\t赛莱克斯MEMS代工行业进展介绍silex Microsystems introduction and business development\\t聂铁轮 北京赛微电子股份有限公司副总经理\\\n</span></div><div><span style=\\\"background-color: rgb(255, 250, 165);-evernote-highlight:true;\\\">Tielun NIE, BOARD MEMBER OF SILEX MICROSYSTEMS” (Sweden), CEO OF Silex microsystems BEIJING\\\n</span></div><div><br/></div><div>15:50-16:15\\t基于GaN材料与器件技术，打造国产化新型功率器件供应链\\\n</div><div>Based on GaN Material and Device Technologies, Build Localization Novel Power Electronics Device Supply Chain\\t袁理 青岛聚能创芯微电子有限公司总经理\\\n</div><div>Li YUAN, General Manager of Qingdao Cohenius Microelectronics Co., Ltd.\\\n</div><div><br/></div><div>15:45-16:05\\t先进封装的趋势和挑战\\\n</div><div>Trends and challenges of advanced packaging\\\n</div><div>\\t谢 鸿 博士 通富微电子股份有限公司先进封装研究院副总经理\\\n</div><div>Dr. Hong XIE, VP of Research institute of Advanced Packaging, TongFu Microelectronics Co., Ltd.\\\n</div><div><br/></div><div>10:20-10:40\\tIDM在智能传感器的研发优势\\\n</div><div>IDM's advantages in the development of intelligent sensors.\\t张宾 广州奥松电子有限公司董事长\\\n</div><div>Bin ZHANG, Chairman of Guangzhou Aosong Electronics Co., Ltd\\\n</div></span>\\\n</div></body></html>\\u0000\"]],\"start1\":0,\"start2\":0,\"length1\":0,\"length2\":2318}]"
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