id: 032684576faf47949b771ecf76f83a5f
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item_id: 687b7709e1804030a6923c42ec35205b
item_updated_time: 1764345475851
title_diff: "[{\"diffs\":[[1,\"你真的懂MEMS吗？\"]],\"start1\":0,\"start2\":0,\"length1\":0,\"length2\":10}]"
body_diff: "[{\"diffs\":[[1,\"<html>\\\r\\\n<head>\\\r\\\n  <title>你真的懂MEMS吗？</title>\\\r\\\n  <basefont face=\\\"微软雅黑\\\" size=\\\"2\\\" />\\\r\\\n  <meta http-equiv=\\\"Content-Type\\\" content=\\\"text/html;charset=utf-8\\\" />\\\r\\\n  <meta name=\\\"exporter-version\\\" content=\\\"YXBJ Windows/608924 (zh-CN, DDL); Windows/10.0.0 (Win64); EDAMVersion=V2;\\\"/>\\\r\\\n  <style>\\\r\\\n\\tbody, td {\\\r\\\n\\t  font-family: 微软雅黑;\\\r\\\n\\t  font-size: 12pt;\\\r\\\n\\t}\\\r\\\n  </style>\\\r\\\n</head>\\\r\\\n<body>\\\r\\\n<a name=\\\"7543\\\"></a>\\\r\\\n<h1>你真的懂MEMS吗？</h1>\\\r\\\n\\\r\\\n<div><span style=\\\"margin:0px;\\\"><div style=\\\"padding:8px 0px;margin:8px auto;max-width:700px;\\\"> <div style=\\\"padding:20px 16px 12px;margin:0;background-color:#fff\\\"><div style=\\\"margin:0;padding:0\\\"><div style=\\\"margin:0;padding:0\\\"><h2 style=\\\"font-weight:400;margin:0;padding:0;font-size:22px;margin-bottom:14px\\\"> 你真的懂MEMS吗？ </h2><div style=\\\"margin:0;padding:0;margin-bottom:22px;font-size:0;word-wrap:break-word;word-break:break-all\\\"><span style=\\\"padding:0;display:inline-block;vertical-align:middle;margin:0 10px 10px 0;font-size:15px;-webkit-tap-highlight-color:rgba(0,0,0,0);position:relative\\\"><a style=\\\"margin:0;padding:0;color:#576b95;text-decoration:none;-webkit-tap-highlight-color:rgba(0,0,0,0)\\\"> 半导体行业观察 </a></span><em style=\\\"padding:0;font-style:normal;display:inline-block;vertical-align:middle;margin:0 10px 10px 0;font-size:15px;-webkit-tap-highlight-color:rgba(0,0,0,0);color:rgba(0,0,0,0.3)\\\"></em></div><div style=\\\"margin:0;padding:0;overflow:hidden;color:#333;font-size:17px;word-wrap:break-word;-webkit-hyphens:auto;-ms-hyphens:auto;hyphens:auto;text-align:justify;position:relative;z-index:0\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;font-size:16px\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;text-align:center;margin-top:10px;margin-bottom:10px\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;vertical-align:middle;display:inline-block;\\\"><img src=\\\":/4c4d2c518a7f4a858c9ee5e177c5f872\\\" type=\\\"image/jpeg\\\" data-filename=\\\"640.jpg\\\" style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;height:auto !important;vertical-align:middle\\\"/></div></div></div><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;margin-left:1em;margin-right:1em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;font-size:14px;color:rgb(160,160,160)\\\">来源：内容来自「国海证券代鹏举」，谢谢。</span><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p></div></div></div><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;margin-left:0.5em;margin-right:0.5em\\\"><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">微机电系统（Micro-Electro Mechanical System）是指尺寸在几毫米乃至更小的传感器装置，其内部结构一般在微米甚至纳米量级，是一个独立的智能系统。简单理解， MEMS 就是将传统传感器的机械部件微型化后，通过三维堆叠技术，例如三维硅穿孔 TSV 等技术把器件固定在硅晶元（wafer）上，最后根据不同的应用场合采用特殊定制的封装形式， 最终切割组装而成的硅基传感器。 受益于普通传感器无法企及的 IC 硅片加工批量化生产带来的成本优势， MEMS 同时又具备普通传感器无法具备的微型化和高集成度。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;text-align:center\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;text-align:center;margin-left:0.5em;margin-right:0.5em\\\"><img src=\\\":/f881592436c944aeba3283bf41ee1c4b\\\" type=\\\"image/jpeg\\\" data-filename=\\\"640.jpg\\\" style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;height:auto !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em;text-align:center\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(136,136,136);font-size:13px\\\">传统 ECM 驻极体电容麦克风/Apple Watch 楼氏 MEMS 硅麦克风</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">诸如最典型的半导体发展历史： 从 20 世纪初在英国物理学家弗莱明手下发明的第一个电子管，到 1943 年拥有 17468 个电子三极管的 ENIAC 和 1954 年诞生装有 800 个晶体管的计算机 TRADIC， 到 1954 年飞兆半导体发明了平面工艺使得集成电路可以量产， 从而诞生了 1964 年具有里程碑意义的首款使用集成电路的计算机 IBM 360。 模拟量到数字化、 大体积到小型化以及随之而来的高度集成化，是所有近现代化产业m 发展前进的永恒追求。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;text-align:center;margin-left:0.5em;margin-right:0.5em\\\"><img src=\\\":/e317b374094140f086b1f7adf2ce9ba5\\\" type=\\\"image/jpeg\\\" data-filename=\\\"640.jpg\\\" style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;height:auto !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em;text-align:center\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(136,136,136);font-size:13px\\\">半导体的发展历史： 从电子管-晶体管-集成电路</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">正因为 MEMS 拥有如此众多跨世代的优势， 目前来看我们认为其是替代传统传感器的唯一可能选择，也可能是未来构筑物联网感知层传感器最主要的选择之一。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">1）微型化： MEMS 器件体积小， 一般单个 MEMS 传感器的尺寸以毫米甚至微米为计量单位， 重量轻、耗能低。 同时微型化以后的机械部件具有惯性小、谐振频率高、响应时间短等优点。 MEMS 更高的表面体积比（表面积比体积） 可以提高表面传感器的敏感程度。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">2）硅基加工工艺，可兼容传统 IC 生产工艺：硅的强度、硬度和杨氏模量与铁相当，密度类似铝，热传导率接近钼和钨，同时可以很大程度上兼容硅基加工工艺。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">3）批量生产： 以单个 5mm*5mm 尺寸的 MEMS 传感器为例， 用硅微加工工艺在一片 8 英寸的硅片晶元上可同时切割出大约 1000 个 MEMS 芯片， 批量生产可大大降低单个 MEMS 的生产成本。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">4）集成化： 一般来说，单颗 MEMS 往往在封装机械传感器的同时， 还会集成ASIC 芯片，控制 MEMS 芯片以及转换模拟量为数字量输出。 同时不同的封装工艺可以把不同功能、不同敏感方向或致动方向的多个传感器或执行器集成于一体，或形成微传感器阵列、微执行器阵列，甚至把多种功能的器件集成在一起，形成复杂的微系统。微传感器、微执行器和微电子器件的集成可制造出可靠性、稳定性很高的 MEMS。 随着 MEMS 的工艺的发展，现在倾向于单个 MEMS 芯片中整合更多的功能， 实现更高的集成度。 例如惯性传感器 IMU（Inertial measurement unit） 中， 从最早的分立惯性传感器，到 ADI 推出的一个封装内</span><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px;letter-spacing:1.5px\\\">中集成了三轴陀螺仪、加速度计、磁力计和一个压力传感器以及 ADSP-BF512 Blackfin 处理器的 10 自由度高精度 MEMS 惯性测量单元。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">5）多学科交叉： MEMS 涉及电子、机械、材料、制造、信息与自动控制、物理、化学和生物等多种学科，并集约了当今科学技术发展的许多尖端成果。MEMS 是构筑物联网的基础物理感知层传感器的最主要选择之一。 由于物联网特别是无线传感器网络对器件的物理尺寸、功耗、成本等十分敏感，传感器的微型化对物联网产业的发展至关重要。 MEMS 微机电系统结合兼容传统的半导体工艺， 采用微米技术在芯片上制造微型机械，并将其与对应电路集成为一个整体的技术，它是以半导体制造技术为基础发展起来的， 批量化生产能满足物联网对传感器的巨大需求量和低成本要求。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;text-align:center\\\"><img src=\\\":/530048131304450785027ed2b49f1401\\\" type=\\\"image/png\\\" data-filename=\\\"640.png\\\" style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;height:auto !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em;text-align:center\\\"><strong style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(199,62,58);font-size:16px\\\">物联网时代到来，MEMS的机会</span></strong></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">全球半导体产业中， PC 在主导产业 10 多年后， 已经逐渐让位于消费电子， 随着摩尔定律逐渐到达其瓶颈， 制程的进步已经渐近其物理极限。 根据 MonolithIC 3D 创办人 Zvi Or-Bach 的观点，在 28 纳米之后， 晶圆厂可以继续把晶体做得更小、但却无法更便宜， 对制程要求相对较低的物联网应用可能会成为成熟制程重要的下游产业应用。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;text-align:center;margin-left:0.5em;margin-right:0.5em\\\"><img src=\\\":/a03b953dd5164502a464229f2ed8395c\\\" type=\\\"image/jpeg\\\" data-filename=\\\"640.jpg\\\" style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;height:auto !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em;text-align:center\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(136,136,136);font-size:13px\\\">摩尔定律正在接近极限</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">就目前趋势来看， 高端制程在整个 IC 封装工艺中， 占比已经开始相对下降。 先进制程节点元件的实际工程成本，已经证明对产业界大多数厂商来说都太昂贵；因此半导体产业确实已经分头发展，只有少数会追求微缩至 7 纳米，而大多数仍维持采用 28 纳米或更旧节点的设计。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">未来可以预见未来大规模下游应用主要会以新的消费电子例如 AR/VR， 以及物联网例如智能驾驶、 智慧物流、 智能家居等。 而传感器做为感知层，是不可或缺的关键基础物理层部分，物联网的快速发展，将会给 MEMS 行业带来巨大的发展红利。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">物联网的系统架构主要包括三部分：感知层、传输层和应用层。 感知层的作用主要是获取环境信息和物与物的交互， 主要由传感器、 微处理器和 RF 无线收发器等组成； 传输层主要用于感知层之间的信息传递，由包括 NB IOT、Zig Bee、Thread、蓝牙等通讯协议组成；应用层主要包括云计算、云存储、 大数据和数据挖掘以及人机交互等软件应用层面构成。 感知层传感器处于整个物联网的最底层，是数据采集的入口，物联网的“心脏”， 有着巨大的发展空间。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;text-align:center;margin-left:0.5em;margin-right:0.5em\\\"><img src=\\\":/c081897c7f8c42dd9768cfd7fffd5ff3\\\" type=\\\"image/jpeg\\\" data-filename=\\\"640.jpg\\\" style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;height:auto !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em;text-align:center\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(136,136,136);font-size:13px\\\">物联网的三层架构</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">物联网产业覆盖面广，小到手机，大到新能源汽车以及大量未联网的设备、终端都将联通，为市场带来万亿市值增长潜力。互联网、智能手机的出世推动了信息产业第二波浪潮，但目前已趋于成熟，增速较为平缓，而以传感网、物联网为代表的信息获取或信息感知正在推动信息产业进入第三次浪潮，物联网时代已经启动。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;text-align:center;margin-left:0.5em;margin-right:0.5em\\\"><img src=\\\":/c3154aa060ae4519bdfca9945f52de09\\\" type=\\\"image/jpeg\\\" data-filename=\\\"640.jpg\\\" style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;height:auto !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em;text-align:center\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(136,136,136);font-size:13px\\\">物联网：第三次产业化浪潮</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">2015 年，全球物联网产业规模已接近 3500 亿美元，中国物联网产业规模达到7500 亿人民币。 Forrester Research 预测，到 2020 年，物联网产业的规模要比信息互联网大 30 倍，将有 240 亿台物联网设备接入互联网，真正实现万物互联。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">随着国内设计、制造、封测等多个环节的技术和工艺正在逐步成熟， MEMS 作为物理量连接半导体的产物，将恰逢其时的受益于物联网产业的发展， MEMS 在消费电子、汽车电子、工业控制、军工、智能家居、智慧城市等领域将得到更为广泛的应用，根据 Yole developpement 的预测， 2016-2020 年 MEMS 传感器市场将以 13%年复合成长率增长， 2020 年 MEMS 传感器市场将达到 300 亿美元,前景无限。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;text-align:center;margin-left:0.5em;margin-right:0.5em\\\"><img src=\\\":/3aee22c3f75f456e84ff9d675481826d\\\" type=\\\"image/jpeg\\\" data-filename=\\\"640.jpg\\\" style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;height:auto !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em;text-align:center\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;font-size:13px;color:rgb(136,136,136)\\\">MEMS 全球市场产值预测（亿美元）</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">2015 年中国 MEMS 器件市场规模为 308 亿元人民币，占据全球市场的三分之一。从发展速度而言，中国 MEMS 市场增速一直快于全球市场增速。中国 MEMS 器件市场平均增速约 15 - 20%，中国集成电路市场增速约为 7 - 10%，横向对比而言，MEMS 器件市场的增速两倍于集成电路市场。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;text-align:center;margin-left:0.5em;margin-right:0.5em\\\"><img src=\\\":/5bbb51f8d613460a98dd9563a304d595\\\" type=\\\"image/jpeg\\\" data-filename=\\\"640.jpg\\\" style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;height:auto !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em;text-align:center\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(136,136,136);font-size:13px\\\">中国近年 MEMS 传感器市场规模（亿元）</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;text-align:center\\\"><img src=\\\":/426bca07ae5747f182e3f296509f2dc7\\\" type=\\\"image/png\\\" data-filename=\\\"640.png\\\" style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;height:auto !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em;text-align:center\\\"><strong style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(199,62,58);font-size:16px\\\">MEMS产业链一览，国外领先</span></strong></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">MEMS 没有一个固定成型的标准化的生产工艺流程， 每一款 MEMS 都针对下游特定的应用场合， 因而有独特的设计和对应的封装形式，千差万别。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">MEMS 和传统的半导体产业有着巨大的不同， 她是微型机械加工工艺和半导体工艺的结合。 MEMS 传感器本身一般是个比较复杂的微型物理机械结构，并没有 PN 结。但同时单个 MEMS 一般都会集成 ASIC 芯片并植在硅晶圆片上， 再封装测试和切割，后道工艺流程又类似传统 COMS 工艺流程。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">因此 MEMS 性能的提升很大程度上不会过分依赖于硅晶圆制程工艺的升级， 而更倾向于根据下游应用需求定制设计、对微型机械结构的优化、对不同材料的选择，实现每一款传感器的独特功能，因此也不存在传统半导体工艺晶圆厂不同世代的制程工艺升级路线图（ROAD MAP）。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;text-align:center;margin-left:0.5em;margin-right:0.5em\\\"><img src=\\\":/c96fdd7be4e147458704b9d5271cdbc9\\\" type=\\\"image/jpeg\\\" data-filename=\\\"640.jpg\\\" style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;height:auto !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em;text-align:center\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;font-size:13px;color:rgb(136,136,136)\\\">IC 制程工艺更接近于 2D 平面 VS MEMS3 维立体堆叠</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">典型的 MEMS 系统如图所示，由传感器、信息处理单元、执行器和通讯/接口单元等组成。其输入是物理信号，通过传感器转换为电信号，经过信号处理（模拟的和/或数字的）后，由执行器与外界作用。每一个微系统可以采用数字或模拟信号（电、光、磁等物理量）与其它微系统进行通信。 MEMS 将电子系统与周围环境有机结合在一起，微传感器接收运动、光、热、声、磁等自然界信号，信号再被转换成电子系统能够识别、处理的电信号，部分 MEMS 器件可通过微执行器实现对外部介质的操作功能。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;text-align:center;margin-left:0.5em;margin-right:0.5em\\\"><img src=\\\":/c347add2f6f24db394b2479b3b9f80a9\\\" type=\\\"image/jpeg\\\" data-filename=\\\"640.jpg\\\" style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;height:auto !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em;text-align:center\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(136,136,136);font-size:13px\\\">传感器工作原理</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">MEMS 产业链类似于传统半导体产业，主要包括了四大部分：前端 fabless 设计环节、 ODM 代工晶圆厂生产环节、 封装测试到下游最终应用的四大环节。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;text-align:center;margin-left:0.5em;margin-right:0.5em\\\"><img src=\\\":/7c788b56f76842c8b12b01d4d5d88f68\\\" type=\\\"image/jpeg\\\" data-filename=\\\"640.jpg\\\" style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;height:auto !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em;text-align:center\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;font-size:13px;color:rgb(136,136,136)\\\">MEMS 产业链划分</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">全球前十名 MEMS 厂商主要包括博世、意法半导体、惠普、德州仪器、佳能、InvenSense、 Avago 和 Qorvo、 楼氏电子、松下等等。 其中 BOSCH 因为其在汽车电子和消费电子的双重布局，牢牢占据着行业的第一的位置，其营收约占前五大公司合计营收的三分之一。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">大部分 MEMS 行业的主要厂商是以 Fabless 为主， 例如楼氏、 HP、佳能等。同时，平行的也有 IDM 厂商垂直参与到整条产业链的各个环节，比如 Bosch、 ST等都建有自己的晶元代工生产线。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;text-align:center;margin-left:0.5em;margin-right:0.5em\\\"><img src=\\\":/a8a180e900bf4cc69237130546805dd2\\\" type=\\\"image/jpeg\\\" data-filename=\\\"640.jpg\\\" style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;height:auto !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em;text-align:center\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(136,136,136);font-size:13px\\\">全球主要 MEMS 厂商的生产模式定位</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">基于之前阐述的 MEMS 本身区别于传统 IC 产业特征， 我们认为行业的核心门槛在于两点：设计理念和封测工艺。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">前者不仅仅包括对传统 IC 设计的理解，更需要包括多学科的综和，例如微观材料学、力学、 化学等等。 原因是因为内部涉及机械结构，空腔，和不同的应用场景，如导航，光学，物理传感等。可以展开细说。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">后者， 因为单个 MEMS 被设计出来的使用用途、使用环境、 实现目的不同，对封装有着各种完全不同的要求。 比如对硅麦有防水和不防水区分，光学血氧浓度传感器需要穿孔和空腔安装透镜，气压传感器需要向外界敞开不能密封等等。 在整个 MEMS 生产中，封测的成本占比达到 35%-60%以上。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;text-align:center;margin-left:0.5em;margin-right:0.5em\\\"><img src=\\\":/68807df700254773a24a96c00aadc0ec\\\" type=\\\"image/png\\\" data-filename=\\\"640.png\\\" style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;height:auto !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em;text-align:center\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(136,136,136);font-size:13px\\\">MEMS 成本结构拆分</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;margin-top:10px;margin-bottom:10px\\\"><div style=\\\"margin:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;display:inline-block;width:100%;border-width:0 0 0 10px;border-style:solid;border-left-color:rgb(199,62,58);border-right-color:rgb(199,62,58);padding:10px;border-radius:5px 0 0 5px;box-shadow:rgb(153,153,153) 0 0.2em 0.2em;background-color:rgb(239,239,239)\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(199,62,58)\\\"><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em\\\"><strong style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\">一、设计环节</strong></p></div></div></div></div></div></div></div></div><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">作为 MEMS 的核心门槛之一， 半导体设计环节因为其 fabless 的轻资产特性，及其核心门槛， 国内公司投资较为积极。 国内有众多比较知名的 Fabless， 例如海思半导体、 展讯、 RDA、全志科技、 国民技术、澜起科技等等。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">但国内 MEMS 行业的 fabless 规模相对较小， 但市场规模来说具备很大的发展空间。 面对国内巨大的消费电子市场， 自产自销满足国内部分中低端市场需求，也是国内 Fabless 公司的一个捷径。例如苏州敏芯， 他的微硅麦克风传感器产品已经渗透至以消费类电子产品为主的各个细分应用中，成功应用在 MOTOROLA， SONY， ASUS，联想，魅族，小米等品牌客户的产品上。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">中国 MEMS 设计企业主要集中于华东地区，约占全国企业总数的 55%，其中，以上海、苏州、无锡三地为产业集中地：</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">• 上海：深迪，矽睿，丽恒，芯敏，微联，铭动，文襄，天英，巨哥</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">• 苏州：明皜，敏芯，双桥，多维，能斯达，汶灏，圣赛诺尔，希美</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">• 无锡：美新，乐尔，康森斯克，微奥，杰德，必创，微纳，芯奥微，沃浦</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">• 其他： 深圳瑞声，山东歌尔，河北美泰，山西科泰，郑州炜盛，北京水木智芯，浙江大立，武汉高德，成都国腾，西安励德，天津微纳芯等。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;text-align:center;margin-left:0.5em;margin-right:0.5em\\\"><img src=\\\":/e654b0662962410b88bb43af64388913\\\" type=\\\"image/jpeg\\\" data-filename=\\\"640.jpg\\\" style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;height:auto !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em;text-align:center\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(136,136,136);font-size:13px\\\">国内 MEMS 企业布局</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;margin-top:10px;margin-bottom:10px\\\"><div style=\\\"margin:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;display:inline-block;width:100%;border-width:0 0 0 10px;border-style:solid;border-left-color:rgb(199,62,58);border-right-color:rgb(199,62,58);padding:10px;border-radius:5px 0 0 5px;box-shadow:rgb(153,153,153) 0 0.2em 0.2em;background-color:rgb(239,239,239)\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(199,62,58)\\\"><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em\\\"><strong style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\">二、制造环节：代工、 封测</strong></p></div></div></div></div></div></div></div></div><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">统计的前十大中，设计全为中资而制造和封装绝大多数为外资。但外资的成长性弱于中资，所以中资制造业和测试封装业的实际增长应高于统计的平均数据。尤其是测试封装，增速均高于行业： 5 年复合增速长电科技 16.5%、华天科技26.94%、通富微电 8.25%、晶方科技 34.2%。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">IC 产业通过单一工艺即可支持整个产品世代，其产品制造工艺标准化程度高，批量化生产相对简易。而 MEMS 产品种类丰富、功能各异，工艺开发过程中呈现出“一类产品，一种制造工艺”的特点。 MEMS 芯片或器件的种类多达上万、个性特征明显，除了采用相同的硅材料外，不同的 MEMS 产品之间没有完全标准的工艺，产品参量较多，每类产品品种实现量产都需要从前端研发重新投入，工艺开发周期长，且量产率较传统半导体生产行业相比更低，依靠单一种类的MEMS 产品很难支撑一个公司。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">虽然不同种类的 MEMS 从用途来说截然不同，封装形式也是天壤之别。但是从封装结构上来说， 大致可以分为以下 3 类： 封闭式封装（Closed Package）、开放空腔式封装（Open Cavity Package）、眼式封装（Open Eyed Package）。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;text-align:center;margin-left:0.5em;margin-right:0.5em\\\"><img src=\\\":/e4541322b71a469ca988581c78735ee3\\\" type=\\\"image/jpeg\\\" data-filename=\\\"640.jpg\\\" style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;height:auto !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em;text-align:center\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;font-size:13px;color:rgb(136,136,136)\\\">MEMS封装形式</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">中国 MEMS 产业在 2009 年后才逐渐起步，目前尚未形成规模，产业整体处于从实验室研发向商用量产转型阶段。国内 MEMS 厂家在营业规模、技术水平、产品结构、产业环境上与国外有明显差距， 60%-70%的设计产品依旧集中在加速度计、压力传感器等传统领域，对新产品（例如生物传感器、化学传感器、陀螺仪）的涉足不多。工艺水平与经验缺失制约代工厂发展，制造环节亟需填补空白。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">微机电系统的生产制造涵盖设计、制造和封测。由于系统器件具有高度定制化、制程控制与材质特殊的特点，封装与测试环节至少占到整个成本的 60%。因此，为了能够在日益严峻的产品价格下跌趋势下有效降低成本，多数无晶圆或轻晶圆MEMS 供应商将封装与测试环节外包给专业封测厂商，这也将为 MEMS 器件封装及测试厂商带来机遇。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">随着国家政策扶持，近两年中国 MEMS 产线投资兴起， 2014 年国内 MEMS 代工厂建设投资超过 1.5 亿美元，但是技术的匮乏和人才的缺失依然是产业短板。MEMS 技术与 IC 技术有本质差异，技术核心领域在于工艺和制造， MEMS 制造结构复杂、高度定制化、依赖于专用设备，且具有很强的规模效应。目前，本土MEMS产业明显落后国际水平，国内市场严重依赖进口，市场份额基本被Bosch、ST、 ADI、 Honeywell、 Infineon、 AKM 等国际大公司寡头垄断，中高端 MEMS传感器进口比例达 80%，传感器芯片进口比例高达 90%。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">MEMS 制造目前主要分为三类，纯 MEMS 代工、 IDM 企业代工和传统集成电路 MEMS 代工。与其将 MEMS 看做一种产品倒不如把它看成一种工艺， MEMS器件依赖各种工艺和许多变量。只有经过多年的工艺改进及测试， MEMS 器件才能真正被商品化。研发团队一般需要大量时间来搜索有关工艺及材料物理特性方面的资料。利用单一一种材料(如多晶硅)制得的器件可能需要根据多晶硅的来源及沉积方法来标记工艺中的变化。因此每一种工艺都需要长期、大量的数据来稳定一个工艺。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">国内 MEMS 代工厂华润上华、中芯国际、上海先进等，硬件条件虽与国际水平相近，但开发能力远不及海外代工厂；中国 MEMS 代工企业还未积累起足够的工艺技术储备和大规模市场验证反馈的经验，加工工艺的一致性、可重复性都不能满足设计需要，产品的良率和可靠性也无法达到规模生产要求。因此商业化阶段的本土设计公司更愿意同 TSMC、 X-Fab、 Silex 等海外成熟代工厂合作。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">代工环节薄弱导致好的设计无法迅速产品化并推向市场，极大地制约了中国MEMS 产业的发展，产业中游迫切需要有工艺经验和高端技术的厂商填补洼地。虽然大部分 MEMS 业务仍然掌握在 IDM 企业中，随着制造工艺逐渐标准化，MEMS 产业未来会沿着传统集成电路行业发展趋势，将逐步走向设计与制造分离的模式。纯 MEMS 代工厂与 MEMS 设计公司合作开发的商业模式将成为未来业务模式的主流。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;text-align:center;margin-left:0.5em;margin-right:0.5em\\\"><img src=\\\":/d0d7c32f3d11436ebb7812cb79479bd4\\\" type=\\\"image/jpeg\\\" data-filename=\\\"640.jpg\\\" style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;height:auto !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;text-align:center;margin-left:0.5em;margin-right:0.5em\\\"><img src=\\\":/0c99e89378064ee7a16bd5b071d73188\\\" type=\\\"image/jpeg\\\" data-filename=\\\"640.jpg\\\" style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;height:auto !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em;text-align:center\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(136,136,136);font-size:13px\\\">MEMS 代工企业类型比较</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">MEMS 技术自八十年代末开始受到世界各国的广泛重视，对比传统集成电路，该系统拥有诸多优点，体积小、重量轻，最大不超过一个厘米，甚至仅仅为几个微米，其厚度更加微小。 MEMS 的原材料以硅为主，价格低廉，产量充足批量</span><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px;letter-spacing:1.5px\\\">，良率高。同时使用寿命长，耗能低，但由于 MEMS 的工艺难度高，其良率仍然与传统 IC 制造相比有一定的差距。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">就工艺方面，目前全球主要的技术途径有三种，一是以美国为代表的以集成电路加工技术为基础的硅基微加工技术；二是以德国为代表发展起来的利用 X 射线深度光刻、微电铸、微铸塑的 LIGA 技术；三是以日本为代表发展的精密加工技术，如微细电火花 EDM、超声波加工。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">尽管 MEMS 和 IC 在封装和外观上具有相似性，但实质上 MEMS 在芯片设计和制造工艺方面与 IC 不同。 IC 一般是平面器件，通过数百道工艺步骤，在若干个特定平面层上使用图案化模板制造而来，表现出特定的电学或电磁学功能来实现模拟、数字、计算或储存等特定任务。理想状态下， IC 基本元件（晶体管）是一种纯粹的电学器件，几乎所有的 IC 应用和功能方面具有共通性。相对地，MEMS 是一种 3D 微机械结构。基于硅工艺技术， MEMS 相比于传统的“大型器件”，微米级别的 MEMS 器件能够更广泛、灵活地应用在汽车电子、消费电子等领域。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">国内 MEMS 主要的传感器设计公司有美新半导体、明皜传感、矽睿科技、深迪半导体、敏芯微电子等。 同时国内 MEMS 企业规模还相对较小，单个企业较少有年销售额超过 1 亿美金； 高端传感器还主要是以进口产品为主，整个 MEMS 传感器主要以国外品牌为主。根据《中国传感器产业发展白皮书（2014）》显示中国中高端传感器的进口比例达 80%，传感器芯片的进口比例更高达 90%，显示本土中高端传感器技术和产业化的落后。从产品使用领域结构来看， 国内 MEMS 公司在营业规模、技术水平、产品结构、与国外有明显差距， 60%-70%的设计产品集中在加速度计、压力传感器等传统领域。工艺开发是我国 MEMS 行业目前面临最主要的问题， 产品在本身技术实力和生产工艺还有待于进步。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;text-align:center;margin-left:0.5em;margin-right:0.5em\\\"><img src=\\\":/d497921a045446c0acd8b3c5e6de8091\\\" type=\\\"image/jpeg\\\" data-filename=\\\"640.jpg\\\" style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;height:auto !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em;text-align:center\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(136,136,136);font-size:13px\\\">中国传感器产品结构</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">虽然国内主要集中在初级阶段，中低端应用。 但从近几年的发展来看， 中国地区已经成为过去五年全球 MEMS 市场发展最快的地区。 2015 年，我国 MEMS 市场规模接近 300 亿元，且连续两年增幅高达 15%以上；而且从中长期来看，国内 MEMS 行业的发展增速会快于国外， 到 2020 年，我国传感器市场增幅将进一步提升，年平均增长率将达到 20%以上，继续保持全球前列。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;text-align:center\\\"><img src=\\\":/79e82370da1c41408ccf5a609248a24d\\\" type=\\\"image/png\\\" data-filename=\\\"640.png\\\" style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;height:auto !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em;text-align:center\\\"><strong style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(199,62,58);font-size:16px\\\">MEMS 行业发展趋势</span></strong></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;margin-top:10px;margin-bottom:10px\\\"><div style=\\\"margin:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;display:inline-block;width:100%;border-width:0 0 0 10px;border-style:solid;border-left-color:rgb(199,62,58);border-right-color:rgb(199,62,58);padding:10px;border-radius:5px 0 0 5px;box-shadow:rgb(153,153,153) 0 0.2em 0.2em;background-color:rgb(239,239,239)\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(199,62,58)\\\"><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em\\\"><strong style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\">1） MEMS 封装将会向标准化演进， 模块平台标准化意味着更快的反应速度。</strong></p></div></div></div></div></div></div></div></div><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">根据 Amkor 公司的观点， MEMS 的整合正在向标准化、 平台化演进。 从之前众多分散复杂的封装形式（Discrete Packaging）逐渐演化到以密封模压封装（Overmolded）、集成电路便面裸露封装（Exposed Die Surface）、空腔封装（Cavity Package） 这三种载体为主的封装形式。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;text-align:center;margin-left:0.5em;margin-right:0.5em\\\"><img src=\\\":/a50ded18edae4e579a0eaae2959eb837\\\" type=\\\"image/jpeg\\\" data-filename=\\\"640.jpg\\\" style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;height:auto !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em;text-align:center\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(136,136,136);font-size:13px\\\">MEMS 封装向标准化演进</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;margin-top:10px;margin-bottom:10px\\\"><div style=\\\"margin:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;display:inline-block;width:100%;border-width:0 0 0 10px;border-style:solid;border-left-color:rgb(199,62,58);border-right-color:rgb(199,62,58);padding:10px;border-radius:5px 0 0 5px;box-shadow:rgb(153,153,153) 0 0.2em 0.2em;background-color:rgb(239,239,239)\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(199,62,58)\\\"><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em\\\"><strong style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\">2） SIP（System In Package） 系统级的高度集成化会是 MEMS 未来在互联网应用场合的主要承载形式。</strong></p></div></div></div></div></div></div></div></div><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">随着下游最重要的应用场景物联网的快速发展， MEMS 在 IOT 平台的产品未来会逐渐演化到 SIP 封装就显得尤为重要。往往单个 MEMS 模块会集成包括 MCU（Microcontroller Unit）、 RF 模块（Radio Frequenc，例如蓝牙， NB IOT 发射模块） 和 MEMS 传感器等多个功能部分。 系统级的封装带来的同样是快速响应速度和及时的产品更新换代，这对于消费电子产品来说极端重要。目前很多代工厂或者封装厂例如 Amkor 都在推广标准化的 IOT MEMS 平台产品。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;text-align:center;margin-left:0.5em;margin-right:0.5em\\\"><img src=\\\":/1df534169ccc47dcace087dc5a27edc2\\\" type=\\\"image/jpeg\\\" data-filename=\\\"640.jpg\\\" style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;height:auto !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em;text-align:center\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(136,136,136);font-size:13px\\\">MEMS 在 IOT 应用领域的 SIP 封装</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">而采用的封装形式主要会以空腔封装（Cavity Package）和混合空腔封装（Hybird Cavity Package）。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;text-align:center;margin-left:0.5em;margin-right:0.5em\\\"><img src=\\\":/366958c4181f404b838314edeb28f1c5\\\" type=\\\"image/jpeg\\\" data-filename=\\\"640.jpg\\\" style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;height:auto !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em;text-align:center\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(136,136,136);font-size:13px\\\">MEMS 在 IOT 应用领域的 SIP 封装</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;margin-top:10px;margin-bottom:10px\\\"><div style=\\\"margin:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;display:inline-block;width:100%;border-width:0 0 0 10px;border-style:solid;border-left-color:rgb(199,62,58);border-right-color:rgb(199,62,58);padding:10px;border-radius:5px 0 0 5px;box-shadow:rgb(153,153,153) 0 0.2em 0.2em;background-color:rgb(239,239,239)\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(199,62,58)\\\"><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em\\\"><strong style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\">3）未来 MEMS 产品可能会逐渐演变为低端、中端和高端三类。</strong></p></div></div></div></div></div></div></div></div><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">低端 MEMS 主要应用于消费电子类产品如智能手机、平板电脑等。 中端 MEMS 主要应用于</span><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px;letter-spacing:1.5px\\\">GPS 辅 助导 航 系 统 、工 业 自 动 化 、 工 程 机械 等 工 业 领 域 。 根据 Yole Developpment 报告，作为智能感知时代的重要硬件基础， 2014 年中低端MEMS 传感器市场规模达到 130 亿美元，预计到 2018 年，中低端 MEMS 市场产值将以 12%～13%的复合增长率增长至 225 亿美元。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;letter-spacing:1.5px;margin-left:0.5em;margin-right:0.5em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;color:rgb(76,74,74);font-size:15px\\\">在今后 5 到 10 年内随着 MEMS 技术的成熟，以智能手机以及平板电脑为主要应用对象的低端MEMS 市场利润将逐渐下降，但未来在可穿戴设备、物联网领域还有一定机遇；以工业、医疗及汽车为应用对象的中端 MEMS 还将持续提供增长和盈利；未来以工业 4.0 和国防军工市场也应用对象的高端 MEMS 将为带来显著的超额收益。据市场研究机构预测，高端 MEMS 市场在 2016 年~2021 年的其年复合增长达到 13.4%，而同期全球 MEMS 市场的复合年增长率仅为 8.9%，其中军事、航天、高端医疗电子和工业 4.0 应用四个领域将会占未来高端 MEMS 市场营收的 80%。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p></div></div></div><div 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!important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;text-align:center;margin:15px 0\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;display:inline-block;width:95%;vertical-align:top;box-shadow:rgb(152,152,152) 0 0 2px;border-width:2px 0 0;border-radius:10px;border-style:solid;border-color:rgb(199,62,58) rgb(62,62,62) rgb(62,62,62);background-color:rgb(255,255,255);padding-right:10px;padding-bottom:10px;padding-left:10px\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% 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!important;word-wrap:break-word !important;padding:3px;display:inline-block;border-bottom:5px solid rgb(199,62,58);font-size:15px;\\\"><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em\\\"><strong style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\">识别二维码，回复关键词</strong></p></div></div></div><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;margin-right:0;margin-bottom:10px;margin-left:0\\\"><div style=\\\"margin:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;display:inline-block;width:95%;vertical-align:top;padding:10px;border-width:0;border-radius:10px;border-style:none;border-color:rgb(62,62,62);overflow:hidden;box-shadow:rgb(231,231,231) 0 0 6px\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;display:inline-block;vertical-align:middle;width:35%;box-shadow:rgb(0,0,0) 0 0 0;padding-right:5px\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;margin-right:0;margin-left:0\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;vertical-align:middle;display:inline-block;width:100%;box-shadow:rgb(0,0,0) 0 0 0\\\"><img src=\\\":/fb415a08a0614c2f8bd91eba7444e315\\\" type=\\\"image/jpeg\\\" data-filename=\\\"640.jpg\\\" style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;height:auto !important;vertical-align:middle;width:100%\\\"/></div></div></div></div><div style=\\\"margin:0;padding:0;max-width:100% 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style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\">回复关键词，阅读更多</strong></p></div></div></div><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;font-size:12px;color:rgb(62,62,62)\\\"><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;letter-spacing:0\\\">并购｜财报｜CES｜开源｜</span><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;letter-spacing:0\\\">射频｜5G｜氮化镓｜展会｜老兵戴辉</span></p></div></div></div></div></div></div></div></div></div><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;text-align:justify;font-size:15px;color:rgb(100,100,100);\\\"><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;white-space:normal\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;letter-spacing:0\\\">回复 投稿，看《如何成为“半导体行业观察”的一员 》</span><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em;white-space:normal\\\">回复 搜索，还能轻松找到其他你感兴趣的文章！</p></div></div></div></div></div></div><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;text-align:center;margin-top:10px;margin-bottom:10px\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;vertical-align:middle;display:inline-block;\\\"><img src=\\\":/d9b3e219979c4009b2c87eeaf2fa9442\\\" type=\\\"image/jpeg\\\" data-filename=\\\"640.jpg\\\" style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;height:auto !important;vertical-align:middle\\\"/></div></div></div><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;margin-top:10px;margin-bottom:10px\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;display:inline-block;vertical-align:top;background-color:rgb(255,255,255)\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;display:inline-block;vertical-align:top;padding-right:5px;font-size:14px\\\"><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em\\\"><strong style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\">关于摩尔精英</strong></p></div></div></div></div><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;font-size:14px;color:rgb(100,100,100)\\\">摩尔精英是领先的芯片设计加速器，愿景“让中国没有难做的芯片”，业务包括“芯片设计服务、供应链管理、人才服务、企业服务”，客户覆盖1500家芯片公司和50万工程师。我们致力于提供ASIC设计和Turnkey解决方案，从Spec/FPGA/算法到芯片交付，包括：芯片架构规划、IP选型、前端设计、DFT、验证、物理设计、版图、流片、封装和测试服务等。 自2012年以来，我们的团队一直专注于积累技术能力，帮助客户实现最优芯片性能，并支持Turnkey、NRE、专业咨询和驻场等灵活服务模式。 摩尔精英目前全球员工230人，总部位于上海，在北京、深圳、合肥、重庆、苏州、广州、成都、西安、南京、厦门、新竹和硅谷等地有分支机构。</span></p><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p></div></div></div><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;display:inline-block;vertical-align:top;width:10%\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;text-align:center;margin-top:10px;margin-bottom:10px\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;vertical-align:middle;display:inline-block;width:100%\\\"><img src=\\\":/92441240490f40abbd2005489933747c\\\" type=\\\"image/gif\\\" data-filename=\\\"640.gif\\\" style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;height:auto !important;vertical-align:middle;width:100%\\\"/></div></div></div></div><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;display:inline-block;vertical-align:top;width:90%;padding-left:10px\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em\\\"><br style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"/></p></div></div></div><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;margin-top:10px;margin-right:0;margin-left:0\\\"><div style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important\\\"><p style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;clear:both;min-height:1em\\\"><span style=\\\"margin:0;padding:0;max-width:100% !important;box-sizing:border-box !important;-webkit-box-sizing:border-box !important;word-wrap:break-word !important;font-size:15px\\\">点击阅读原文，了解摩尔精英</span></p></div></div></div></div></div></div></div></div></div><ul style=\\\"margin:0;padding:0\\\"></ul><div style=\\\"margin:0;padding:0;padding-top:15px\\\"><a href=\\\"https://mp.weixin.qq.com/s?__biz=MzU3OTA0MjQ3Mg==&amp;mid=2247517315&amp;idx=1&amp;sn=30af3ca7d8e96c5b6b8a97d26909c2a6&amp;chksm=fd6ee944ca1960528927d6849a3cd02021adb4e589312edd3135948db4cd40fd56df75cd4092&amp;mpshare=1&amp;scene=1&amp;srcid=0126ywNDMfQSMFqbFUG1UXAW##\\\" style=\\\"margin:0;padding:0;color:#576b95;text-decoration:none;-webkit-tap-highlight-color:rgba(0,0,0,0)\\\">阅读原文</a></div></div></div></div></span>\\\n</div></body></html>\\u0000\"]],\"start1\":0,\"start2\":0,\"length1\":0,\"length2\":124915}]"
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